| Patent Number |
Title Of Patent |
Date Issued |
| 7553702 |
Integrating a heat spreader with an interface material having reduced void size |
June 30, 2009 |
| An integrated heat spreader and die coupled with solder are disclosed herein. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is |
| 7485495 |
Integrated heat spreader with intermetallic layer and method for making |
February 3, 2009 |
| Integrated heat spreader and die coupled with solder in a manner forming an intermetallic compound having a higher liquidus temperature than the liquidus temperature of the solder used to create the intermetallic compound are described herein. |
| 7239517 |
Integrated heat spreader and method for using |
July 3, 2007 |
| Integrated heat spreader and die coupled with solder. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is varied. |
| 7220622 |
Method for attaching a semiconductor die to a substrate and heat spreader |
May 22, 2007 |
| Disclosed are embodiments of a method of attaching a die to a substrate and a heat spreader to the die in a single heating operation. A number of conductive bumps extending from the die may also be reflowed during this heating operation. Other embodiments are described and claimed. |
| 7183641 |
Integrated heat spreader with intermetallic layer and method for making |
February 27, 2007 |
| Integrated heat spreader and die coupled with solder in a manner forming an intermetallic compound having a higher liquidus temperature than the liquidus temperature of the solder used to create the intermetallic compound are described herein. |
| 7164585 |
Thermal interface apparatus, systems, and methods |
January 16, 2007 |
| An apparatus and system, as well as fabrication methods therefor, may include a die having a surface and a primary material comprising tin, pure tin, or substantially pure tin coupled to the surface. A heat dissipating element may be coupled to the primary material. |
