| Patent Number |
Title Of Patent |
Date Issued |
| 7355273 |
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, me |
April 8, 2008 |
| An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor su |
| 7291543 |
Thin flip-chip method |
November 6, 2007 |
| Methods for thinning a bumped semiconductor wafer, as well as methods for producing flip-chips of very thin profiles, are disclosed. According to the methods of the present invention, a mold compound is interspersed between conductive bumps on the active face of a wafer to provide suppor |
| 7217596 |
Stacked die module and techniques for forming a stacked die module |
May 15, 2007 |
| A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in c |
| 7186576 |
Stacked die module and techniques for forming a stacked die module |
March 6, 2007 |
| Embodiments of the present technique relate to forming die stacks. Specifically, embodiments of the present technique include a method of forming and testing semiconductor die comprising forming a die stack of at least two semiconductor die without attaching either of the at least tw |
| 7029931 |
Stacked die module and techniques for forming a stacked die module |
April 18, 2006 |
| A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in c |
| 6962867 |
Methods of fabrication of semiconductor dice having back side redistribution layer accessed usin |
November 8, 2005 |
| An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor su |
| 6905946 |
Thin flip-chip method |
June 14, 2005 |
| Methods for thinning a bumped semiconductor wafer, as well as methods for producing flip-chips of very thin profiles, are disclosed. According to the methods of the present invention, a mold compound is interspersed between conductive bumps on the active face of a wafer to provide suppor |
| 6800930 |
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, an |
October 5, 2004 |
| An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor su |
| 6682955 |
Stacked die module and techniques for forming a stacked die module |
January 27, 2004 |
| A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in c |
| 6664131 |
Method of making ball grid array package with deflectable interconnect |
December 16, 2003 |
| A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is |
| 6630738 |
Deflectable interconnect |
October 7, 2003 |
| A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is |
| 6506681 |
Thin flip--chip method |
January 14, 2003 |
| Methods for thinning a bumped semiconductor wafer, as well as methods for producing flip-chips of very thin profiles, are disclosed. According to the methods of the present invention, a mold compound is interspersed between conductive bumps on the active face of a wafer to provide suppor |
| 6503777 |
Deflectable interconnect |
January 7, 2003 |
| A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is |
| 6501176 |
Deflectable interconnect |
December 31, 2002 |
| A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is |
| 6285081 |
Deflectable interconnect |
September 4, 2001 |
| A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is |
