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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Jaciauskiene; Jane
Address:
Vilnius, LT
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
8298325 Electroless deposition from non-aqueous solutions October 30, 2012
A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
7686875 Electroless deposition from non-aqueous solutions March 30, 2010
A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
7306662 Plating solution for electroless deposition of copper December 11, 2007
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating
7297190 Plating solutions for electroless deposition of copper November 20, 2007
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substance in an amount suf










 
 
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