| Patent Number |
Title Of Patent |
Date Issued |
| 6426154 |
Ceramic circuit board |
July 30, 2002 |
| The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit plate bonded to the ceramic substrate through a brazing material layer; wherein the brazing material layer is composed of Al--Si group brazing material and an amount of Si conta |
| 5907187 |
Electronic component and electronic component connecting structure |
May 25, 1999 |
| In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps comprise not less than two kinds of connecting bumps different in melting point or not less than |
| 5714801 |
Semiconductor package |
February 3, 1998 |
| A semiconductor package is disclosed which is provided with a multilayer ceramic substrate such as, for example, a multilayer aluminum nitride substrate having a surface for mounting a semiconductor device and, at the same time, having an inner wiring layer electrically connected to the |
| 5622769 |
Ceramic circuit board having a thermal conductivity substrate |
April 22, 1997 |
| According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance |
| 5412160 |
Circuit board |
May 2, 1995 |
| A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at |
| 5326623 |
Circuit board |
July 5, 1994 |
| A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a c |
| 5041700 |
Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride struct |
August 20, 1991 |
| A circuit board includes an aluminum nitride substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a metal oxynitride layer represented by formula Al.sub.u Ml.sub.v M2.sub.x O.sub.y N.sub.z (wherein M1 represents a metal selected from the |
| 5019187 |
Brazing paste for bonding metal and ceramic |
May 28, 1991 |
| According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element |
| 4924033 |
Brazing paste for bonding metal and ceramic |
May 8, 1990 |
| According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element |
| 4919731 |
Brazing paste |
April 24, 1990 |
| The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each |
| 4835344 |
Electronic component parts and method for manufacturing the same |
May 30, 1989 |
| The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each |
