| Patent Number |
Title Of Patent |
Date Issued |
| 5909058 |
Semiconductor package and semiconductor mounting part |
June 1, 1999 |
| A thin type semiconductor package having a low thermal resistance and a low electric resistance is disclosed, that comprises a nitride ceramic supporting substrate having a first main surface and a second main surface, the nitride ceramic supporting substrate having via-holes that pa |
| 5907187 |
Electronic component and electronic component connecting structure |
May 25, 1999 |
| In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps comprise not less than two kinds of connecting bumps different in melting point or not less than |
| 5622769 |
Ceramic circuit board having a thermal conductivity substrate |
April 22, 1997 |
| According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance |
| 5453991 |
Integrated circuit device with internal inspection circuitry |
September 26, 1995 |
| A highly-integrated semiconductor IC device includes a semiconductive substrate, on which an internal function circuit is arranged to have a first plurality of input terminals and a second plurality of output terminals. A logic circuit is arranged on the substrate and is connected to |
| 5412160 |
Circuit board |
May 2, 1995 |
| A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at |
| 5326623 |
Circuit board |
July 5, 1994 |
| A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a c |
| 5041700 |
Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride struct |
August 20, 1991 |
| A circuit board includes an aluminum nitride substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a metal oxynitride layer represented by formula Al.sub.u Ml.sub.v M2.sub.x O.sub.y N.sub.z (wherein M1 represents a metal selected from the |
| 5008582 |
Electronic device having a cooling element |
April 16, 1991 |
| In an electric device having a package included an electric circuit element therein, a cooling fan is fixed on the package directly. The fan is formed of piezoelectric elements and a flexible cooling fin. The fan generates the cooling air flow due to vibration of the piezoelectric elemen |
| 4970571 |
Bump and method of manufacturing the same |
November 13, 1990 |
| According to the present invention, there is provided a method for forming a bump and comprising the steps of dipping a semiconductor element with an Al electrode and a passivation film formed thereon in a palladium solution containing 5 to 2,000 ppm of at least one element selected from |
| 4963701 |
Circuit board |
October 16, 1990 |
| Disclosed is an aluminum nitride thin film circuit board having an aluminum nitride substrate and a conductive thin film pattern formed on the substrate. The conductive thin film pattern has a multi-layer structure selected from the group consisting of Ti/Ni/Au, Ti/Pd/Au, Ti/Pt/Au, Ni/Au |
| 4919731 |
Brazing paste |
April 24, 1990 |
| The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each |
| 4916261 |
Circuit substrate and producing method of the same |
April 10, 1990 |
| A circuit substrate comprises a sintered oxide body of barium, tin and boron as an insulating body which is able to be fired at a temperature less than 1300.degree. C. The circuit substrate is further improved in moisture resistance by containing titanium or securing substantially the |
| 4906341 |
Method of manufacturing semiconductor device and apparatus therefor |
March 6, 1990 |
| A plating solution is stored in an annular plating solution storage. A plating solution tank having an open upper portion is arranged in a hollow portion of the storage. A mesh-like anode electrode is arranged on the bottom portion of the plating tank. Hold members are attached to an upp |
| 4855251 |
Method of manufacturing electronic parts including transfer of bumps of larger particle sizes |
August 8, 1989 |
| According to the present invention, a method is provided of manufacturing electronic parts, comprising a first step of forming on the surface of a substrate a bump wherein the metal particles of that portion of the bump which contacts the surface of the substrate have a larger diameter t |
| 4835344 |
Electronic component parts and method for manufacturing the same |
May 30, 1989 |
| The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each |
| 4797530 |
Ceramic circuit substrates and methods of manufacturing same |
January 10, 1989 |
| A ceramic circuit substrate can be manufactured by a method comprising the steps of (i) providing an electrically insulating ceramic substrate; and (ii) irradiating a predetermined region of said ceramic substrate with an energy beam such that at least a portion of said region is rendere |
| 4772985 |
Thick film capacitor |
September 20, 1988 |
| Disclosed is a thick film capacitor comprising (a) a sintered layer of a ferroelectric material mainly consisting of one or more ferroelectric inorganic compounds having a perovskite structure and an inorganic binder having a eutectic composition which experiences a liquid phase at a |
| 4659611 |
Circuit substrate having high thermal conductivity |
April 21, 1987 |
| A high thermal conductivity circuit substrate is provided comprising a sintered aluminum nitride ceramic substrate consisting essentially of one member selected from the group of yttrium, the rare earth metals and the alkali earth metals and an electrically conductive thick film paste fo |
| 4584456 |
Production of resistor from insulating material by local heating |
April 22, 1986 |
| A resistor is formed by locally heating an insulating material layer between conductors to convert the heated material into a first resistor element. A second resistor element is formed to contact the first resistor element while measuring the resistance between the conductors, until a |
