| Patent Number |
Title Of Patent |
Date Issued |
| 7465221 |
Polishing apparatus |
December 16, 2008 |
| A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of ab |
| 7465216 |
Polishing apparatus |
December 16, 2008 |
| A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of ab |
| 7258598 |
Polishing solution supply system, method of supplying polishing solution, apparatus for and meth |
August 21, 2007 |
| A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of ab |
| 6727170 |
Semiconductor device having an improved interlayer conductor connections and a manufacturing met |
April 27, 2004 |
| There is described a semiconductor device which prevents a short circuit between a wiring layer formed in interlayer insulating films and vertical conductor plugs formed in the vicinity of the wiring layer, and a method of manufacturing the semiconductor device. The semiconductor device |
| 6602725 |
Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor dev |
August 5, 2003 |
| The semiconductor device includes a semiconductor wafer which is partitioned into chip regions by scribe line area. A device pattern is formed in the device forming region included in the chip region. A monitor pattern is formed from the same material as that of the device patterns in |
| 6568996 |
Polishing agent for processing semiconductor, dispersant used therefor and process for preparing |
May 27, 2003 |
| The object of the present invention is to provide a polishing agent for processing semiconductor, which can control coagulation and sedimentation and has stable and re-productive polishing properties under a proper dispersing condition to prevent generation of polishing flaw. The pol |
| 6303944 |
Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor dev |
October 16, 2001 |
| The semiconductor device includes a semiconductor wafer which is partitioned into chip regions by scribe line area. A device pattern is formed in the device forming region included in the chip region. A monitor pattern is formed from the same material as that of the device patterns in |
| 6278187 |
Semiconductor device having an improved interlayer conductor connections and a manufacturing met |
August 21, 2001 |
| There is described a semiconductor device which prevents a short circuit between a wiring layer formed in interlayer insulating films and vertical conductor plugs formed in the vicinity of the wiring layer, and a method of manufacturing the semiconductor device. The semiconductor device |
