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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Iwasaki; Masanobu
Address:
Tokyo, JP
No. of patents:
8
Patents:












Patent Number Title Of Patent Date Issued
7465221 Polishing apparatus December 16, 2008
A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of ab
7465216 Polishing apparatus December 16, 2008
A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of ab
7258598 Polishing solution supply system, method of supplying polishing solution, apparatus for and meth August 21, 2007
A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of ab
6727170 Semiconductor device having an improved interlayer conductor connections and a manufacturing met April 27, 2004
There is described a semiconductor device which prevents a short circuit between a wiring layer formed in interlayer insulating films and vertical conductor plugs formed in the vicinity of the wiring layer, and a method of manufacturing the semiconductor device. The semiconductor device
6602725 Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor dev August 5, 2003
The semiconductor device includes a semiconductor wafer which is partitioned into chip regions by scribe line area. A device pattern is formed in the device forming region included in the chip region. A monitor pattern is formed from the same material as that of the device patterns in
6568996 Polishing agent for processing semiconductor, dispersant used therefor and process for preparing May 27, 2003
The object of the present invention is to provide a polishing agent for processing semiconductor, which can control coagulation and sedimentation and has stable and re-productive polishing properties under a proper dispersing condition to prevent generation of polishing flaw. The pol
6303944 Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor dev October 16, 2001
The semiconductor device includes a semiconductor wafer which is partitioned into chip regions by scribe line area. A device pattern is formed in the device forming region included in the chip region. A monitor pattern is formed from the same material as that of the device patterns in
6278187 Semiconductor device having an improved interlayer conductor connections and a manufacturing met August 21, 2001
There is described a semiconductor device which prevents a short circuit between a wiring layer formed in interlayer insulating films and vertical conductor plugs formed in the vicinity of the wiring layer, and a method of manufacturing the semiconductor device. The semiconductor device










 
 
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