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Inventor: Ishimoto; Takashi
Address: Mitaka, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7129507 |
Chip mis-position detection method |
October 31, 2006 |
| The invention is a method for detecting float or peel of semiconductor chips arranged in X and Y axes directions diced and bonded to a dicing tape on a stage. The method includes detecting float or peel of the semiconductor chips in a respective horizontal or longitudinal row arrange |
| 6366102 |
Wafer probing machine |
April 2, 2002 |
| An inspection tray on which an inspection wafer is placed is detachably mounted on a special tray on which a cleaning wafer is placed. The special tray can be horizontally drawn out from a body of a wafer probing machine. Thus, it is possible to easily confirm types of cleaning wafer and |
| 5568056 |
Wafer prober |
October 22, 1996 |
| A test head is rotatably supported by a main body of device. This test head is rotatable between an inspecting position electrically connected to a probe card and a retracted position being retracted from the inspecting position. The test head is connected thereto with a cylinder for wei |
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