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Ishii; Hideki
Itami, JP
No. of patents:

Patent Number Title Of Patent Date Issued
5373113 Solder reflow mounting board December 13, 1994
A process for reflow mounting an electronic component includes coating a terminal electrode on a mounting board with a second solder having a second melting point higher than a reflow temperature, placing the mounting board with the electronic component on a mounting land on a convey

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