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Inventor: Inomata; Teruji
Address: Kanagawa, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7554191 |
Semiconductor device having a heatsink plate with bored portions |
June 30, 2009 |
| A heatsink plate is to be fixed to a substrate with sufficient strength, so as to prevent the heatsink plate from being stripped off, to thereby secure reliability on the performance of the semiconductor chip. The heatsink plate has both the upper and lower surfaces of the fixing sec |
| 7370786 |
Bonding method and bonding apparatus |
May 13, 2008 |
| Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bondin |
| 6932262 |
Bonding method and bonding apparatus |
August 23, 2005 |
| Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bondin |
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