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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Inbe; Takashi
Address:
Tokyo, JP
No. of patents:
2
Patents:




Patent Number Title Of Patent Date Issued
6864526 Capacitor with via plugs forming first and second electrodes in a multilayer wiring structure of March 8, 2005
A capacitor which can be manufactured easily without an addition of photo masks and manufacturing processes is obtained.The capacitor has a plural via plugs (1a to 1c) which function as a first electrode and a plural via plugs (2a to 2c) which function as a second electrode. The via plug
6705922 Method and apparatus for polishing a semiconductor substrate wafer March 16, 2004
A semiconductor substrate wafer 2 is supported on a wafer-supporting table 3 so that a surface to be polished is directed upward, a polishing roller 1 is bring to contact with the surface to be polished of the semiconductor substrate wafer 2, and the polishing roller is rolled over the w


 
 
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