Resources Contact Us Home
Ichimura; Teruhiko
Kanagawa, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7163895 Polishing method January 16, 2007
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top r
5496749 Method of manufacturing thin film transistors in a liquid crystal display apparatus March 5, 1996
A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when

  Recently Added Patents
Intelligent sensor network
Instrumenting configuration and system settings
Qualification screening system and screening method thereof, qualification screening device and device under qualification screening
Image processing apparatus and image processing method
Audio/video program-related hyperlink printer
Medical imaging probe with rotary encoder
  Randomly Featured Patents
Method and apparatus for applying a minimum flow of anhydrous ammonia at targeted rates due to limitations existing in current distribution/delivery
Catalytic dewaxing of middle distillates
Vehicle wheel front face
Pet door panel insert
Driving device and optical device using the same
Dual hemispherical collectors
Block management method, and storage system and controller using the same
Persistent caching directory level support
Transmission device
Device for forming connection elements