Resources Contact Us Home
Ichimura; Teruhiko
Kanagawa, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7163895 Polishing method January 16, 2007
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top r
5496749 Method of manufacturing thin film transistors in a liquid crystal display apparatus March 5, 1996
A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when

  Recently Added Patents
Control method and allocation structure for flash memory device
System and method for stranded file opens during disk compression utility requests
Lateral double diffused metal oxide semiconductor device and method of manufacturing the same
Under bump passive components in wafer level packaging
Cake knife handle
Wind energy system having a connection protection device
Interconnect, bus system with interconnect and bus system operating method
  Randomly Featured Patents
Non-volatile memory
Circuit arrangement for monitoring a control circuit
Interconnection element for an asynchronous time-division multiplex transmission system
Emergency lighting ballast for compact fluorescent lamps with integral starters
Toroidal continuous variable transmission
Crosstie random access memory element and a process for the fabrication thereof
Impingement cooling for turbofan exhaust assembly
Apparatus and method for powering up with hysteresis inactive
Method for insulating walls of furnace
Data network with independent transmission channels