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Inventor: Ichimura; Teruhiko
Address: Kanagawa, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7163895 |
Polishing method |
January 16, 2007 |
| The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top r |
| 5496749 |
Method of manufacturing thin film transistors in a liquid crystal display apparatus |
March 5, 1996 |
| A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when |
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