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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Ichimura; Teruhiko
Address:
Kanagawa, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7163895 Polishing method January 16, 2007
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top r
5496749 Method of manufacturing thin film transistors in a liquid crystal display apparatus March 5, 1996
A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when










 
 
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