Resources Contact Us Home
Ichimura; Teruhiko
Kanagawa, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7163895 Polishing method January 16, 2007
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top r
5496749 Method of manufacturing thin film transistors in a liquid crystal display apparatus March 5, 1996
A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when

  Recently Added Patents
Establishing a graphical user interface (`GUI`) theme
Polar nematic compounds
Fused thiazole derivatives as kinase inhibitors
Pixel circuit
Generating and modifying textual code interfaces from graphical programs
Multi-carrier operation for wireless systems
Eyeglass component
  Randomly Featured Patents
Human til cells expressing recombinant TNF prohormone
Methods of forming trenched isolation regions
Hydroximic acid halogenides, method for the production and use thereof
Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy
Nail extractor, moulding remover and pry bar tool with indexable head
Semiconductor substrate with islands of diamond and resulting devices
Locking device
Information recording medium and method of manufacturing resinous substrate for use in the recording medium
Surface complemental heat dissipation device
Cutting tool and insert with serrated contact surfaces between holder and insert