Resources Contact Us Home
Ichimura; Teruhiko
Kanagawa, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7163895 Polishing method January 16, 2007
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top r
5496749 Method of manufacturing thin film transistors in a liquid crystal display apparatus March 5, 1996
A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when

  Recently Added Patents
Field device configuration system
Method and apparatus for rebuilding data in a dispersed data storage network
Disk-based storage device having read channel memory that is selectively accessible to disk controller
Prioritizing application data for transmission in a wireless user device
Portion of a display panel with an unhappy facial expression icon
Non-intrusive processor tracing
Decrementing settings for a range of power caps when a power cap is exceeded
  Randomly Featured Patents
Swivel rocker
Drum type washing machine
Surgical ball hooks
Tetrahydrobenzindolone derivatives
Thin structure of display panel
Counter pressure system for stringed instruments
Method of manufacture and the use of a functional proppant for determination of subterranean fracture geometries
Linear vibration motor
Substituted-3-phenyl ureas
Elevator vibration damping system having damping control