Resources Contact Us Home
Ichimura; Teruhiko
Kanagawa, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7163895 Polishing method January 16, 2007
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top r
5496749 Method of manufacturing thin film transistors in a liquid crystal display apparatus March 5, 1996
A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when

  Recently Added Patents
Generalized AC-DC synchronous rectification techniques for single- and multi-phase systems
Build process management system
Substrate processing apparatus and display method of substrate processing apparatus
Battery power management system and method
Ice data collection system
Electronic hand-held device
Memory management configuration
  Randomly Featured Patents
Content server selection for accessing content in a content distribution network
Soap dish
Method and apparatus for the continuous extrusion of solid articles
Ink follower for writing tool
Distillative separation of carbon dioxide from light hydrocarbons
Folded bit line-shared sense amplifiers
Image display device commutator
Dielectrically-isolated integrated circuit complementary transistors for high voltage use
Positive clutch plate separator system
Preparation of herbal medicines by using a multi-enzyme system, herbal medicines prepared and their uses