Resources Contact Us Home
Ichimura; Teruhiko
Kanagawa, JP
No. of patents:

Patent Number Title Of Patent Date Issued
7163895 Polishing method January 16, 2007
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top r
5496749 Method of manufacturing thin film transistors in a liquid crystal display apparatus March 5, 1996
A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when

  Recently Added Patents
Light barrier and method for detecting objects
Method for preparing an organic film at the surface of solid support under non-electrochemical conditions, solid support thus obtained and preparation kit
Pandemic protocol for emergency dispatch
Rate controlled first in first out (FIFO) queues for clock domain crossing
Non-volatile memory cell containing a nano-rail electrode
Magnetic levitation motor used in lens module
Device to facilitate moving an electrical cable of an electric vehicle charging station and method of providing the same
  Randomly Featured Patents
Electric motor driven speed control
Firearm bore cleaning device
Apparatus for inducing attitudinal head movements for passive virtual reality
Decoder with reduced synchronization capture time
Cleaning device for tubes
Clear conditioning detersive compositions containing polysiloxanes with at least one cyclic side chain
Cache system having branch target address cache
Magnetic resonance apparatus and method to acquire and display calibration images
Process for producing a thermoplastic film using plastic bottle recyclate
Quarter turn ball valve