Resources Contact Us Home
Hwei; Chit
Singapore, SG
No. of patents:

Patent Number Title Of Patent Date Issued
6638844 Method of reducing substrate coupling/noise for radio frequency CMOS (RFCMOS) components in semi October 28, 2003
A method of reducing substrate coupling and noise for one or more RFCMOS components comprising the following steps. A substrate having a frontside and a backside is provided. One or more RFCMOS components are formed over the substrate. One or more isolation structures are formed within t

  Recently Added Patents
System and method for providing restrictions on the location of peer subnet manager (SM) instances in an infiniband (IB) network
Fluid conduit with PTC fabric heating
Liquid crystal display wherein the data lines covered by each pixel electrode are supplied with data signals of opposite polarities
Process for the preparation of ethylene homopolymers or copolymers in a high-pressure reactor controlled by a model based predictive controller
Method for manufacturing photoelectric conversion device
Method to calibrate RF paths of an FHOP adaptive base station
Image processing apparatus and image processing method
  Randomly Featured Patents
Method for injection molding a plastic part using a film gate
Adaptive equalizer and related method thereof
Developer interface and associated methods for system for querying and consuming web-based data
Document handling apparatus
Narrow field electromagnetic sensor system and method
Vanadyl complexes of hydroxamate chelators and pharmaceutical compositions comprising them
Optical fibre, waveguide, and optical active device
Adjustable pivot axis for bedknife assembly
Lead wire forming apparatus capable of preventing the peeling of the solder from the lead wire
Lead retention and sealing device