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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Hwei; Chit
Address:
Singapore, SG
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6638844 Method of reducing substrate coupling/noise for radio frequency CMOS (RFCMOS) components in semi October 28, 2003
A method of reducing substrate coupling and noise for one or more RFCMOS components comprising the following steps. A substrate having a frontside and a backside is provided. One or more RFCMOS components are formed over the substrate. One or more isolation structures are formed within t










 
 
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