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Inventor: Hunnel; Larry B.
Address: Otis Orchards, WA
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 4837928 |
Method of producing a jumper chip for semiconductor devices |
June 13, 1989 |
| In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attaching the gold alloy to the subs |
| 4745036 |
Jumper chip for semiconductor devices |
May 17, 1988 |
| In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attaching the gold alloy to the subs |
| 4640438 |
Cover for semiconductor device packages |
February 3, 1987 |
| Covers for semiconductor packages are made by diffusion pressure bonding a coated substrate to a preform at a temperature below the melting point of the preform alloy. An alloy preform is coated on one side with a thin layer of the preform alloy component that has a lower melting point t |
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