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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Hunnel; Larry B.
Address:
Otis Orchards, WA
No. of patents:
3
Patents:












Patent Number Title Of Patent Date Issued
4837928 Method of producing a jumper chip for semiconductor devices June 13, 1989
In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attaching the gold alloy to the subs
4745036 Jumper chip for semiconductor devices May 17, 1988
In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attaching the gold alloy to the subs
4640438 Cover for semiconductor device packages February 3, 1987
Covers for semiconductor packages are made by diffusion pressure bonding a coated substrate to a preform at a temperature below the melting point of the preform alloy. An alloy preform is coated on one side with a thin layer of the preform alloy component that has a lower melting point t










 
 
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