Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Huber; Andreas
Address:
Munchen, DE
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
7393721 Semiconductor chip with metallization levels, and a method for formation in interconnect structu July 1, 2008
A metallization surface (5), which acts as an etching stop layer during the production of openings (4) in a passivation layer (3) applied to its upper face and protects an interconnect structure (6) arranged underneath it, is arranged in an uppermost metallization level (1). A further










 
 
  Recently Added Patents
Recovery of a hot-pluggable serial communication link
Encoding method, decoding method, encoding device, decoding device, program, and recording medium
Single-wavelength correction method for luminescent homogeneous biological assay
Power supply apparatus for light emitting diode
System and method for judging success or failure of work of robot
Processor and data transfer method
Process for manufacturing a self-sealing composition
  Randomly Featured Patents
Computer systems and methods for collecting, associating, and/or retrieving data
Microporous pressed molded thermal insulator body and method for its production
Dispenser actuator handle
Apparatus and method for assisting gear engagement in controlling the automatic shifting of a manual-automatic transmission
Multi-layered sintered sliding member
Integrated production of gasoline from light olefins in a fluid cracking process plant
Device for extracorporeal irradiation of a liquid containing bilirubin, and method therefor
Socket holder
Uniform charging device
Pasta measurer