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Huber; Andreas
Munchen, DE
No. of patents:

Patent Number Title Of Patent Date Issued
7393721 Semiconductor chip with metallization levels, and a method for formation in interconnect structu July 1, 2008
A metallization surface (5), which acts as an etching stop layer during the production of openings (4) in a passivation layer (3) applied to its upper face and protects an interconnect structure (6) arranged underneath it, is arranged in an uppermost metallization level (1). A further

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