Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Huber; Andreas
Address:
Munchen, DE
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
7393721 Semiconductor chip with metallization levels, and a method for formation in interconnect structu July 1, 2008
A metallization surface (5), which acts as an etching stop layer during the production of openings (4) in a passivation layer (3) applied to its upper face and protects an interconnect structure (6) arranged underneath it, is arranged in an uppermost metallization level (1). A further










 
 
  Recently Added Patents
Apparatus for controllable delay cell and associated methods
Dot templates for object detection in images
Pressing mold for optical lenses and method for manufacturing glass optical lenses
Image processing apparatus, image processing method, and program to create a composite image from color image data and monochrome image data
Simultaneous wafer bonding and interconnect joining
Providing multiple decode options for a system-on-chip (SoC) fabric
Optical input device
  Randomly Featured Patents
Synthetic ion channels
Citrus peeler
Metal matrices for use in high gradient magnetic separation of biological materials and method for coating the same
Inverse vertical seismic profiling while drilling
Collapsible stand for shade umbrellas
Method for improved dyeing
Systems and methods for phase encode placement
Illuminated rotating object
Purification of biologically-produced 1,3-propanediol
Process for the solution mining of subterranean sodium bicarbonate bearing ore bodies