| |
 |
|
|
Inventor: Huang; Hsiang-Ming
Address: Tainan, TW
No. of patents: 5
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7554197 |
High frequency IC package and method for fabricating the same |
June 30, 2009 |
| A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the |
| 7477065 |
Method for fabricating a plurality of elastic probes in a row |
January 13, 2009 |
| A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the |
| 7372286 |
Modular probe card |
May 13, 2008 |
| A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe |
| 7368809 |
Pillar grid array package |
May 6, 2008 |
| A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an array and each has a flattened top to electrically connect to a printed circuit board, PCB, |
| 7316065 |
Method for fabricating a plurality of elastic probes in a row |
January 8, 2008 |
| A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the |
|
|
|
