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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Hua; Fay
Address:
Fremont, CA
No. of patents:
10
Patents:












Patent Number Title Of Patent Date Issued
8242602 Composite solder TIM for electronic package August 14, 2012
A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficien
7960831 Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, June 14, 2011
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that with
7886813 Thermal interface material with carbon nanotubes and particles February 15, 2011
A thermal interface material is provided using composite particles. Advantages include increased thermal conductivity and improved mechanical properties such as lower viscosity. In selected embodiments free particles such as metallic particles or carbon nanotubes, etc. are included i
7816250 Composite solder TIM for electronic package October 19, 2010
A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficien
7704798 Electronic assemblies with hot spot cooling and methods relating thereto April 27, 2010
A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an em
7615476 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, sys November 10, 2009
A nano-sized metal particle composite includes a first metal that has a particle size of about 50 nanometer or smaller. A wire interconnect is in contact with a reflowed nanosolder and has the same metal or alloy composition as the reflowed nanosolder. A microelectronic package is also
7560373 Low temperature solder metallurgy and process for packaging applications and structures formed t July 14, 2009
Methods of forming a microelectronic structure are described. Those methods include applying a solder paste to a portion of a board, wherein the solder paste is not applied to a ball grid array region, and placing a BGA package comprising at least one low temperature solder ball on the
7489033 Electronic assembly with hot spot cooling February 10, 2009
A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an em
7449780 Apparatus to minimize thermal impedance using copper on die backside November 11, 2008
A method and apparatus to minimize thermal impedance using copper on the die or chip backside. Some embodiments use deposited copper having a thickness chosen to complement a given chip thickness, in order to reduce or minimize wafer warpage. In some embodiments, the wafer, having a
7314819 Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, January 1, 2008
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that with










 
 
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