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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Hsu; Cheng-Yuan
Address:
Hsinchu, TW
No. of patents:
31
Patents:












Patent Number Title Of Patent Date Issued
7485529 Method of fabricating non-volatile memory February 3, 2009
A method of fabricating a non-volatile memory is described. A substrate having stacked gate structures thereon is provided. Each stacked gate structure includes a select gate dielectric layer, a select gate and a cap layer. A source region and a drain region are formed in the substra
7436707 Flash memory cell structure and operating method thereof October 14, 2008
A flash memory cell structure has a substrate, a select gate, a first-type doped region, a shallow second-type doped region, a deep second-type doped region, and a doped source region. The substrate has a stacked gate. The select gate is formed on the substrate and adjacent to the st
7391073 Non-volatile memory structure and method of fabricating non-volatile memory June 24, 2008
A method of fabricating a non-volatile memory is described. A substrate having a tunneling layer and a floating gate layer thereon is provided. A mask layer is formed on the floating gate. The mask layer has openings that expose a portion of the floating gate layer. Then, a portion of th
7335940 Flash memory and manufacturing method thereof February 26, 2008
A method for manufacturing flash memory is provided. A tunneling dielectric layer, a conductive layer and a patterned mask layer that exposes a portion of the conductive layer are formed on a substrate. An oxide layer is formed on the exposed conductive layer so that the conductive l
7262096 NAND flash memory cell row and manufacturing method thereof August 28, 2007
A NAND flash memory cell row includes first and second stacked gate structures, control and floating gates, inter-gate dielectric layer, a tunnel oxide layer, doping regions and source/drain regions. The first stacked gate structures has an erase gate dielectric layer, an erase gate
7239555 Erasing method for non-volatile memory July 3, 2007
An erasing method for a non-volatile memory is provided. The method includes the following two major steps. (a) A first voltage is applied to the odd-numbered select gates of each memory row and a second voltage is applied to the even-numbered select gates of each memory row such that
7196371 Flash memory March 27, 2007
A method for fabricating a flash memory is described. A mask layer having openings to expose a portion of the substrate is formed on the substrate. A tunneling dielectric layer is formed at the bottom surface of the openings. Conductive spacers are formed on the sidewalls of the openings
7180128 Non-volatile memory, non-volatile memory array and manufacturing method thereof February 20, 2007
A non-volatile memory is provided. A plurality of stacked gate structure is formed on the substrate. The stacked gate structure includes, upward from the substrate surface, a select gate dielectric layer, a select gate and a cap layer. The spacers are disposed on the sidewalls of the sta
7166513 Manufacturing method a flash memory cell array January 23, 2007
A flash memory cell array comprises a substrate, a string of memory cell structures and source region/drain region. Each of memory cell structures includes a stack gate structure including a select gate dielectric layer, a select gate and a gate cap layer formed on the substrate; a space
7061805 P-channel NAND flash memory and operating method thereof June 13, 2006
A p-channel NAND flash memory includes a plurality of memory cells in series connection between a p-type source region and a p-type drain region. Each memory cell includes a tunneling dielectric layer, a floating gate, and a control gate. An erase gate is formed between two adjacent
7057940 Flash memory cell, flash memory cell array and manufacturing method thereof June 6, 2006
A flash memory cell array comprises a substrate, a string of memory cell structures and source region/drain region. Each of memory cell structures includes a stack gate structure including a select gate dielectric layer, a select gate and a gate cap layer formed on the substrate; a space
7029973 Method of fabricating a flash memory cell April 18, 2006
A method of forming a flash memory cell. A tunnel oxide layer, a floating gate layer, and a dielectric layer are formed on a substrate. A control gate layer is formed on the dielectric layer and then etched to form two control gates. The control gates are oxidized to form a plurality of
7005699 NAND flash memory cell row February 28, 2006
A NAND flash memory cell row includes first and second stacked gate structures, control and floating gates, intergate dielectric layer, tunnel oxide layer, doping regions and source/drain regions. The first stacked gate structures has an erase gate dielectric layer, an erase gate and
6963105 Flash memory cell structure November 8, 2005
A flash memory cell structure has a substrate, a select gate, a first-type doped region, a shallow second-type doped region, a deep second-type doped region, and a doped source region. The substrate has a stacked gate. The select gate is formed on the substrate and adjacent to the stacke
6917070 Single-poly EPROM and method for forming the same July 12, 2005
A single-poly EPROM and method for forming the same. The single-poly EPROM has an isolation region disposed in a substrate to define a striped active area. A deep n-well is located under the isolation region and the striped active area. A gate oxide layer is disposed on the substrate at
6914826 Flash memory structure and operating method thereof July 5, 2005
A flash memory structure is provided. The flash memory structure includes a P-type substrate, a deep N-well set up within the P-type substrate, a P-well set up within the deep N-well, a pair of gate structures set up over the substrate, a select gate set up between the pair of gate s
6911690 Flash memory cell, flash memory cell array and manufacturing method thereof June 28, 2005
A flash memory cell array comprises a substrate, a string of memory cell structures and source region/drain region. Each of memory cell structures includes a stack gate structure including a select gate dielectric layer, a select gate and a gate cap layer formed on the substrate; a space
6875660 Method of manufacturing high coupling ratio flash memory having sidewall spacer floating gate el April 5, 2005
A method of manufacturing a flash memory is provided. First, a substrate with a first gate structure and a second gate structure thereon is provided. The first gate structure and the second gate structure each comprises of a dielectric layer, a first conductive layer and a cap layer.
6869842 Method for manufacturing non-volatile memory cell March 22, 2005
A non-volatile memory cell having a symmetric cell structure is disclosed. The non-volatile memory cell includes a substrate, a tunnel oxide layer, two floating gates, a dielectric layer, a plurality of spacers, a control gate, and two split gates. The substrate has at least two sources
6867099 Spilt-gate flash memory structure and method of manufacture March 15, 2005
A split-gate flash memory structure. The flash memory at least includes a substrate having a trench therein, a floating gate, a select gate and a source/drain region. The floating gate is formed inside the trench such that the upper surface of the floating gate is below the substrate
6855598 Flash memory cell including two floating gates and an erasing gate February 15, 2005
A flash memory includes a substrate, at least a source and two drains formed in the substrate, and the source located between the drains, two tunnel oxide layers formed on the substrate between each drain and the source, a floating gate formed on each of the tunnel oxide layers, a pl
6838343 Flash memory with self-aligned split gate and methods for fabricating and for operating the same January 4, 2005
A flash memory with a self-aligned spilt gate and the methods for fabricating and operating the same are described. The flash cell consists of a substrate having a deep n-type well and a shallow p-type well in the deep n-type well therein, a control gate structure on the gate oxide layer
6828183 Process for high voltage oxide and select gate poly for split-gate flash memory December 7, 2004
A process for forming a high voltage oxide (HV) and a select gate poly for a split-gate flash memory is disclosed. The general difficulty of forming oxides of two different thicknesses for two different areas on the same substrate is alleviated by forming an HV oxide layer over the entir
6794710 Split-gate flash memory structure and method of manufacture September 21, 2004
A split-gate flash memory structure. The flash memory at least includes a substrate having a trench therein, a floating gate, a select gate and a source/drain region. The floating gate is formed inside the trench such that the upper surface of the floating gate is below the substrate
6774428 Flash memory structure and operating method thereof August 10, 2004
A flash memory structure is provided. The flash memory structure includes a P-type substrate, a deep N-well set up within the P-type substrate, a P-well set up within the deep N-well, a pair of gate structures set up over the substrate, a select gate set up between the pair of gate s
6765260 Flash memory with self-aligned split gate and methods for fabricating and for operating the same July 20, 2004
A flash memory with a self-aligned spilt gate and the methods for fabricating and operating the same are described. The flash cell consists of a substrate having a deep n-type well and a shallow p-type well in the deep n-type well therein, a control gate structure on the gate oxide layer
6737700 Non-volatile memory cell structure and method for manufacturing thereof May 18, 2004
A non-volatile memory cell having a symmetric cell structure is disclosed. The non-volatile memory cell includes a substrate, a tunnel oxide layer, two floating gates, a dielectric layer, a plurality of spacers, a control gate, and two split gates. The substrate has at least two sources
6706602 Manufacturing method of flash memory March 16, 2004
A manufacturing method of flash memory. A substrate is provided, on which a gate structure is formed. A first spacer is formed on the sidewalls of the gate structure. A source region is formed in the substrate at one side of the gate structure. A first conductive layer and a sacrificial
6653183 Single-poly EPROM and method for forming the same November 25, 2003
A single-poly EPROM and method for forming the same. The single-poly EPROM has an isolation region disposed in a substrate to define a striped active area. A deep n-well is located under the isolation region and the striped active area. A gate oxide layer is disposed on the substrate at
6569736 Method for fabricating square polysilicon spacers for a split gate flash memory device by multi- May 27, 2003
A method for forming square polysilicon spacers on a split gate flash memory device by a multi-step polysilicon etch process is described. The method can be carried out by depositing a polysilicon layer on the flash memory device structure and then depositing a sacrificial layer, such as
6358827 Method of forming a squared-off, vertically oriented polysilicon spacer gate March 19, 2002
A method is taught for forming a rectangular or near rectangular polysilicon sidewall structure, which can be used as an ultra narrow MOSFET gate electrode. The method employs the use a step on a sacrificial oxide against which the polysilicon sidewall is formed. An etch stop, such a










 
 
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