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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Houle; Sabina J.
Address:
Phoenix, AZ
No. of patents:
30
Patents:












Patent Number Title Of Patent Date Issued
8215536 Rotational-flow spray nozzle and process of using same July 10, 2012
A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.
8067256 Method of making microelectronic package using integrated heat spreader stiffener panel and micr November 29, 2011
A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate
8013439 Injection molded metal stiffener for packaging applications September 6, 2011
In some embodiments, an injection molded metal stiffener for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an inj
7996989 Heat dissipating device with preselected designed interface for thermal interface materials August 16, 2011
Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a
7846778 Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interfac December 7, 2010
An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
7821126 Heat sink with preattached thermal interface material and method of making same October 26, 2010
A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface mat
7723160 Thermal interface structure with integrated liquid cooling and methods May 25, 2010
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provid
7534650 Carbon-carbon and/or metal-carbon fiber composite heat spreader May 19, 2009
A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a
7527090 Heat dissipating device with preselected designed interface for thermal interface materials May 5, 2009
Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a
7473995 Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interfac January 6, 2009
An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
7416922 Heat sink with preattached thermal interface material and method of making same August 26, 2008
A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface mat
7364943 Method of bonding a microelectronic die to a substrate and arrangement to carry out method April 29, 2008
A method and an arrangement to bond a die to a substrate of a die-substrate combination to form a microelectronic package. The method comprises: providing the die-substrate combination including a die, a substrate, pre-connection bumps and an underfill material, the pre-connection bu
7358606 Apparatus to compensate for stress between heat spreader and thermal interface material April 15, 2008
A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the identification of the
7327027 Thermal interface structure with integrated liquid cooling and methods February 5, 2008
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provid
7304381 Package and method for attaching an integrated heat spreader December 4, 2007
In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate wi
7218000 Liquid solder thermal interface material contained within a cold-formed barrier and methods of m May 15, 2007
In a process of making a container barrier upon a heat spreader, the heat spreader is augmented with a cold-formed o-ring, and thereafter, it is bonded to a die. A liquid solder is filled into the space created by the o-ring. The thermal interface material can also have one of several
7195951 Carbon-carbon and/or metal-carbon fiber composite heat spreaders March 27, 2007
A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a
7190585 Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased therm March 13, 2007
A heat spreader, comprising a metal body with attached standoffs located approximately above the integrated circuit, is described. The standoffs should improve bond layer thickness control between the integrated circuit and the heat spreader, leading to a lower cost and lower mass pa
7183140 Injection molded metal bonding tray for integrated circuit device fabrication February 27, 2007
An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate
7030485 Thermal interface structure with integrated liquid cooling and methods April 18, 2006
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provid
7015073 Method of forming heat spreader with down set leg attachment feature March 21, 2006
Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the heat spreader to a s
7014093 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and me March 21, 2006
A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.
6987671 Composite thermal interface devices and methods for integrated circuit heat transfer January 17, 2006
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Thermal interface devices are shown that include at least some deg
6882535 Integrated heat spreader with downset edge, and method of making same April 19, 2005
A downset edge integrated heat spreader is disclosed. The downset edge can be formed to an industrially accepted flatness with a single stamping operation. The downset edge can provide a surface for fastening the downset edge integrated heat spreader to a mounting substrate. The downset
6867978 Integrated heat spreader package for heat transfer and for bond line thickness control and proce March 15, 2005
A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a se
6837306 Carbon-carbon and/or metal-carbon fiber composite heat spreaders January 4, 2005
A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a lar
6756669 Heat spreader with down set leg attachment feature June 29, 2004
Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the heat spreader to a s
6748350 Method to compensate for stress between heat spreader and thermal interface material June 8, 2004
A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader based upon the identifi
6504242 Electronic assembly having a wetting layer on a thermally conductive heat spreader January 7, 2003
An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and prov
6469381 Carbon-carbon and/or metal-carbon fiber composite heat spreader October 22, 2002
A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a lar










 
 
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