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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Hotta; Yuji
Address:
Ibaraki, JP
No. of patents:
19
Patents:












Patent Number Title Of Patent Date Issued
7722965 Electroluminescence device, planar light source and display using the same May 25, 2010
The present invention provides an organic electroluminescence device including an organic layer comprising an emissive layer; a pair of electrodes comprising an anode and a cathode, and sandwiching the organic layer, wherein at least one of the electrodes is transparent; a transparen
7487586 Process for producing semiconductor device February 10, 2009
A process for semiconductor device production by which the reliability of connection with bumps can be easily heightened with higher certainty. The process for producing a semiconductor device comprising a substrate having bumps formed thereon, comprises covering the bumps with an ad
7231706 Method of manufacturing an anisotropic conductive film June 19, 2007
An anisotropic conductive film is prepared by winding an insulated wire around a core member to form one roll of a winding layer, placing an insulating resin film on the obtained winding layer, and repeating the step of winding the insulated wire and the step of placing the insulating
7056406 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture June 6, 2006
A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and
7034101 Polycarbodiimide copolymer and production method thereof April 25, 2006
A polycarbodiimide copolymer which comprises at least one structural unit selected from rubber residues represented by the following formulae (1) and (2) in a number "m": ##STR00001## and a structural unit represented by the following formula (3) in a number "n": ##STR00002## and whi
7018718 Adhesive film for underfill and semiconductor device using the same March 28, 2006
An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and
6890617 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture May 10, 2005
A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and
6846550 Adhesive film for underfill and semiconductor device using the same January 25, 2005
An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring ci
6709606 Anisotropic conductive film and production method thereof March 23, 2004
An anisotropic conductive film 1 comprising an insulating film 2 and plural conductive paths (3, 4), wherein the plural conductive paths are insulated from each other and penetrate the insulating film 2 in the thickness direction of the film, with both ends of the paths being exposed on
6669869 Anisotropic conductive film December 30, 2003
As an anisotropic conductive film capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at a low temperature at which the circuit board is not deteriorated, an anisotropic conductive film is p
6667542 Anisotropic conductive film-containing device December 23, 2003
A semiconductor device containing a circuit board, an anisotropic conductive film and a semiconductor element electrically connected to the circuit board via the anisotropic conductive film, wherein the anisotropic conductive film contains a film substrate made from an insulating resin
6652688 Process for producing semiconductor wafer with adhesive film November 25, 2003
A process for producing a semiconductor wafer having an adhesive film, by adhering an adhesive film onto a bump-formed surface of a semiconductor wafer having formed thereon bumps with a predetermined arrangement, which comprises: determining a particular arrangement axis direction in wh
6613608 Semiconductor wafer with anisotropic conductor film, and method of manufacture thereof September 2, 2003
An anisotropic conductive film 2 is superimposed on a circuit face 1a of a semiconductor wafer 1, and sandwiched and depressurizably surrounded with a flexible film 3 and a rigid plate 4 (or two flexible films) in the laminating direction, followed by depressurization of the surrounded
6597192 Test method of semiconductor device July 22, 2003
A semiconductor device is tested for its function by sandwiching the inventive anisotropic conductive film 1 between a semiconductor device 2 and a circuit board 3, and applying a contact load F of 3-50 gf per one electrode of the device to achieve functionally testable conduction be
6566608 Production method of anisotropic conductive film and anisotropic conductive film produced by thi May 20, 2003
The present invention provides a production method of an anisotropic conductive film, which method includes the steps of (a) winding an insulated wire around a core member to form one roll of a winding layer, this insulated wire including a metal conductor wire and a coating layer mad
6538309 Semiconductor device and circuit board for mounting semiconductor element March 25, 2003
A semiconductor device comprising an anisotropic conductive film and a semiconductor element, wherein the film is bonded to the element on the side comprising an electrode, such that the electrode is electrically connectable to an external circuit via a conductive path in the film. A
6492484 Polycarbodiimide December 10, 2002
A polycarbodiimide represented by the formula (I): ##STR1##wherein R.sup.1 is an alkylene group having 2 to 10 carbon atoms, R.sup.2 is a divalent aromatic group, R.sup.3 is a monovalent aromatic group, k is 0 or an integer of 1 to 30, m is an integer of 2 to 100, and n is 0 or an in
6394821 Anisotropic conductive film and production method thereof May 28, 2002
An anisotropic conductive film 1 comprising an insulating film 2 and plural conductive paths (3, 4), wherein the plural conductive paths are insulated from each other and penetrate the insulating film 2 in the thickness direction of the film, with both ends of the paths being exposed on
6245175 Anisotropic conductive film and production method thereof June 12, 2001
The object of the present invention to provide an anisotropic conductive film capable of establishing electrical connection at a narrow pitch, maintaining strength in the film surface direction that has not been achieved so far, and improving the adhesion to an objective substance, as










 
 
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