| Patent Number |
Title Of Patent |
Date Issued |
| 6967395 |
Mounting for a package containing a chip |
November 22, 2005 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6777789 |
Mounting for a package containing a chip |
August 17, 2004 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6627987 |
Ceramic semiconductor package and method for fabricating the package |
September 30, 2003 |
| A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically |
| 6545345 |
Mounting for a package containing a chip |
April 8, 2003 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6532157 |
Angulated semiconductor packages |
March 11, 2003 |
| A novel semiconductor package comprises a rigid dielectric, e.g., ceramic, substrate having first and second portions joined to one another at respective margins thereof to form an angle, e.g., a right angle, between the portions. Each of the portions has electrically conductive paths |
| 6528875 |
Vacuum sealed package for semiconductor chip |
March 4, 2003 |
| A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package includes a ceramic substrate and a lid that together define a cavity wherein the chip is |
| 6528869 |
Semiconductor package with molded substrate and recessed input/output terminals |
March 4, 2003 |
| Semiconductor chip packages having molded plastic substrates and recessed I/O terminals are disclosed, along with methods of making such packages. In an exemplary embodiment, the molded plastic substrate includes a metal interconnect pattern and a plurality of indentations in a surface t |
