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Inventor: Hiura; Shigeru
Address: Tokyo, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7473991 |
Semiconductor device and electric apparatus |
January 6, 2009 |
| A semiconductor device of an embodiment of the invention has a package substrate, and a semiconductor chip mounted on the package substrate. The semiconductor chip has an output section, and a filter section for decreasing the electromagnetic noise generated from the data communicati |
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