| Patent Number |
Title Of Patent |
Date Issued |
| 7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet |
June 30, 2009 |
| In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an |
| 7513036 |
Method of controlling contact load in electronic component mounting apparatus |
April 7, 2009 |
| A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S1), and from there t |
| 7353596 |
Component mounting method |
April 8, 2008 |
| In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-a |
| 7350289 |
Component feeding head apparatus, for holding a component arrayed |
April 1, 2008 |
| In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device |
| 7296727 |
Apparatus and method for mounting electronic components |
November 20, 2007 |
| After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic co |
| 7266887 |
Substrate transportation apparatus, component mounting apparatus and substrate transportation me |
September 11, 2007 |
| A component-mounted substrate moved to a specified substrate position by a substrate holding-and-moving device is delivered from a top of the substrate holding-and-moving device to a substrate discharge holder, and then while the substrate discharge holder is not moved, the substrate |
