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Inventor:
Hirai; Touru
Address:
Osaka, JP
No. of patents:
6
Patents:




Patent Number Title Of Patent Date Issued
7553459 Apparatus and reactor for generating and feeding high purity moisture June 30, 2009
A safe, reduced pressure apparatus for generating water vapor from hydrogen and oxygen and feeding high purity moisture to processes such as semiconductor production. The apparatus eliminates the possibility of the gas igniting by maintaining the internal pressure of the catalytic re
7368092 Apparatus and reactor for generating and feeding high purity moisture May 6, 2008
A safe, reduced pressure apparatus for generating water vapor from hydrogen and oxygen and feeding high purity moisture to processes such as semiconductor production. The apparatus eliminates the possibility of the gas igniting by maintaining the internal pressure of the catalytic re
7258845 Apparatus and reactor for generating and feeding high purity moisture August 21, 2007
A safe, reduced pressure apparatus for generating water vapor from hydrogen and oxygen and feeding high purity moisture to processes such as semiconductor production. The apparatus eliminates the possibility of the gas igniting by maintaining the internal pressure of the catalytic re
7008598 Reactor for generating moisture March 7, 2006
A reactor for generating moisture wherein ignition of hydrogen gas, backfire to the gas supply source side, the peeling off of the platinum coat catalyst layer inside are prevented more completely to further increase the safety of the reactor for generating moisture and wherein the d
6919056 Reactor for generating moisture July 19, 2005
A reactor for generating moisture wherein ignition of hydrogen gas, backfire to the gas supply source side, and the peeling off of the platinum coat catalyst layer inside are all prevented more completely to further increase the safety of the reactor for generating moisture, and wher
6387158 Method of removing moisture in gas supply system May 14, 2002
A method of removing moisture efficiently in the gas supply system by evacuation at normal temperature without using the baking method. The method involves flowing a gas to remove moisture in the gas supply system with the flow pressure of the gas to remove moisture set at not lower than


 
 
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