| Patent Number |
Title Of Patent |
Date Issued |
| D504433 |
Memory card |
April 26, 2005 |
|
| 7615855 |
IC card and method of manufacturing the same |
November 10, 2009 |
| An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a ba |
| 7478473 |
Method of manufacturing an IC card |
January 20, 2009 |
| The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar ou |
| 7382045 |
IC card and method of manufacturing the same |
June 3, 2008 |
| An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a ba |
| 7308588 |
Memory card |
December 11, 2007 |
| The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of |
| 7120029 |
IC card and method of manufacturing the same |
October 10, 2006 |
| The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar ou |
| 6988668 |
IC card and method of manufacturing the same |
January 24, 2006 |
| An IC body is loaded on a case made of a thermoplastic resin material and sealed to the case with a sealing portion made of thermoplastic resin material, whereby an IC card is manufactured. The IC body includes a wiring substrate formed with an external connection terminal at a back |
