| Patent Number |
Title Of Patent |
Date Issued |
| 7576968 |
Plated terminations and method of forming using electrolytic plating |
August 18, 2009 |
| A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs ar |
| 7344981 |
Plated terminations |
March 18, 2008 |
| A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electron |
| 7263764 |
Method for adjusting performance characteristics of a multilayer component |
September 4, 2007 |
| A method for adjusting the equivalent series resistance (ESR) of a multi-layer component includes providing at least first and second layers separated by an insulating layer, providing a resistive layer between the inslulating layer and one of the first or second electrode layers, and |
| 7177137 |
Plated terminations |
February 13, 2007 |
| A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electron |
| 7161794 |
Component formation via plating technology |
January 9, 2007 |
| Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termi |
| 7154374 |
Plated terminations |
December 26, 2006 |
| Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many t |
| 7152291 |
Method for forming plated terminations |
December 26, 2006 |
| Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many |
| 7067172 |
Component formation via plating technology |
June 27, 2006 |
| Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termi |
| 6982863 |
Component formation via plating technology |
January 3, 2006 |
| Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termi |
| 6972942 |
Plated terminations |
December 6, 2005 |
| Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typic |
| 6960366 |
Plated terminations |
November 1, 2005 |
| Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typic |
| 6757152 |
Cascade capacitor |
June 29, 2004 |
| Multi-layer and cascade capacitors for use in high frequency applications and other environments are disclosed. The subject capacitor may have multiple capacitor components or aspects thereof in an integrated package. Such components may include, for example, thin film BGA components, |
