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Inventor:
Hartwell; Peter G.
Address:
Palo Alto, CA
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
8030754 Chip cooling channels formed in wafer bonding gap October 4, 2011
One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured










 
 
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