Resources Contact Us Home
Hartwell; Peter G.
Palo Alto, CA
No. of patents:

Patent Number Title Of Patent Date Issued
8030754 Chip cooling channels formed in wafer bonding gap October 4, 2011
One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured

  Recently Added Patents
Methods and systems for optimizing data accesses
Light receiving element with offset absorbing layer
Method of forming wafer level mold using glass fiber and wafer structure formed by the same
Tungsten barrier and seed for copper filled TSV
Starch networks as absorbent or superabsorbent materials and their preparation by extrusion
Radio communication system, transmission apparatus, reception apparatus, and radio communication method in radio communication
Antennas and their coupling characteristics for wireless power transfer via magnetic coupling
  Randomly Featured Patents
Adjustable keyboard supporting mechanism
Method and system for removal of resource manager affinity during restart in a transaction processing system
CMOS power sensor
Method and kit for the preparation of radiopharmaceuticals
Systems and methods for automatic gain control for multichannel receivers
Automated traffic engineering for multi-protocol label switching (MPLS) with link utilization as feedback into the tie-breaking mechanism
Covalent attachment of polymers onto macromolecular chromophores by nucleophilic substitution reaction for inkjet printing
System and method for seaming high-modulus, high-tenacity, low-elongation fabrics
Process for the reaction and absorption of gaseous air pollutants, apparatus therefor and method of making same
System and method for determining timing characteristics of a circuit design