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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Haj-Ali-Ahmadi; Javad
Address:
Austin, TX
No. of patents:
8
Patents:












Patent Number Title Of Patent Date Issued
5363310 System and method for partial order filling November 8, 1994
A method and apparatus are provided for placing a plurality of Stock Keeping Units (SKUs), e.g., brands in transport units wherein quantities of SKUs, not equal to standard SKU packages, e.g. cases, can be ordered. A material handling system, including a work area, robot, conveyors, and
5313097 High density memory module May 17, 1994
A memory module is built up from a power distribution assembly in the form of plates forming a capacitor of low inductance and a flexible circuit substrate. The circuit substrate is populated with precisely positioned contact pads for the power, read, write and address lines of memory ch
5290710 Method for testing integrated circuits on a carrier substrate March 1, 1994
A method and apparatus is provided for testing integrated circuits and permanently affixing the ICs which are successfully tested to a product level carrier substrate. A modular test oven is used which allows the chips to be electrically and thermally tested with the chips non-perman
5148003 Modular test oven September 15, 1992
A method and apparatus is provided for testing integrated circuits and permanently affixing the ICs which are successfully tested to a product level carrier substrate. A modular test oven is used which allows the chips to be electrically and thermally tested with the chips non-perman
5140879 Variable array punch August 25, 1992
A system is provided which utilizes a plurality of sequentially controlled magnetic repulsion punches arranged in a variable array to punch a constantly moving substrate. These punches are disposed adjacent the constant velocity substrate on which holes, or vias are formed as the pun
5053853 Modular electronic packaging system October 1, 1991
An electronic circuit packaging module includes a lower substrate, an upper cooling unit, and a frame disposed between the substrate and cooling unit. The substrate carries a plurality of integrated circuit chips with lead-outs to a plurality of downwardly protruding dimpled contact poin
5037311 High density interconnect strip August 6, 1991
An interconnect strip is provided for effecting electrical interconnection between pluralities of conductor pads disposed on circuit boards or the like in a high density configuration. The strip is fabricated from a polymer film carrier having laminated thereon a metal foil with pres
4943242 Zero insertion force high density connector system July 24, 1990
A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulative strip carrying a plurality o










 
 
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