| Patent Number |
Title Of Patent |
Date Issued |
| 7365379 |
Solid state imaging unit and endoscope |
April 29, 2008 |
| A solid state image pickup device includes: a first area defined on a principal surface of a semiconductor substrate; a second area defined in an area adjacent to the first area along a first direction; and a third area defined in an area adjacent to the second area along the first d |
| 7227575 |
Linear image sensor chip and linear image sensor |
June 5, 2007 |
| A linear image sensor chip is manufactured by forming an image pickup section, peripheral circuit sections, a plurality of bonding pads, and a light-suppressing layer on a semiconductor substrate having an elongated shape. In this case, each of the bonding pads is formed outer than p |
| 6781167 |
Semiconductor device and its manufacture |
August 24, 2004 |
| A CCD type solid state image pickup device having: a number of photoelectric conversion elements formed in and on the semiconductor substrate in a matrix configuration of rows and columns; a plurality of VCCDs each having a vertical channel region formed along each column of the phot |
| 5463475 |
Semiconductor delay line driven by an input signal-derived reference signal |
October 31, 1995 |
| A method of driving a CCD semiconductor delay line capable of providing a good delay characteristic without externally supplying a clock signal. An intermittent reference signal is extracted from the color burst signal of an inputted television signal. Using the intermittent reference si |
