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Inventor: Haga; Chris
Address: McKinney, TX
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7498203 |
Thermally enhanced BGA package with ground ring |
March 3, 2009 |
| The invention provides thermally enhanced BGAs and methods for their fabrication with a ground ring suitable for operably coupling to either the frontside or backside, or both, of an IC chip mounted on a substrate. The methods and devices of the invention disclosed include the fabric |
| 7084494 |
Semiconductor package having integrated metal parts for thermal enhancement |
August 1, 2006 |
| A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A c |
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