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Inventor:
Haase; Michael A.
Address:
St. Paul, MN
No. of patents:
26
Patents:












Patent Number Title Of Patent Date Issued
8193543 Monochromatic light source with high aspect ratio June 5, 2012
Light emitting systems are disclosed. The light emitting system includes an LED that emits light at a first wave-length. A primary portion of the emitted first wavelength light exits the LED from a top surface of the LED that has a minimum lateral dimension Wmin. The remaining portion of
7952110 LED device with re-emitting semiconductor construction and converging optical element May 31, 2011
A light source is provided comprising an LED component having an emitting surface, which may comprise: i) an LED capable of emitting light at a first wavelength; and ii) a re-emitting semiconductor construction which comprises a second potential well not located within a pn junction havi
7902542 Adapted LED device with re-emitting semiconductor construction March 8, 2011
An article includes an LED that has an emitting surface. A reemitting semiconductor structure has an emitting surface and converts light emitted by the LED to light of a different wavelength. At least one of the emitting surfaces frustrates total internal reflection.
7863634 LED device with re-emitting semiconductor construction and reflector January 4, 2011
Briefly, the present disclosure provides a device comprising: a) an LED capable of emitting light at a first wavelength; b) a re-emitting semiconductor construction which comprises a potential well not located within a pn junction; and c) a reflector positioned to reflect light emitt
7645478 Methods of making displays January 12, 2010
Methods of forming displays are described. The displays have zinc oxide row and column drivers integrated onto the same display substrate as zinc oxide pixel transistors and organic light emitting diodes. The organic light emitting diodes are prepared, at least in part, using a thermal
7615501 Method for making a thin film layer November 10, 2009
A method of making a patterned layer comprises directing a beam of vaporized material toward a reflector such that the beam of vaporized material impinges an impingement surface of the reflector and is redirected from the reflector through one or more apertures in a shadow mask and o
7541610 LED device with re-emitting semiconductor construction and converging optical element June 2, 2009
A light source is provided including an LED component having an emitting surface, which may include: i) an LED capable of emitting light at a first wavelength; and ii) a re-emitting semiconductor construction which includes a second potential well not located within a pn junction having
7538689 Methods and systems utilizing a programmable sign display located in proximity to a traffic ligh May 26, 2009
Methods and systems use a programmable sign display located in proximity to a traffic light to provide information to motorists upon the motorists directing their attention toward the traffic light. The programmable sign display may receive programming for content to be displayed in vari
7532790 Method of coupling light into microresonators May 12, 2009
A method of making a microresonator device includes the steps of providing at least a first substrate and providing a waveguide integrated on the substrate. The waveguide includes a core and a metal cladding layer on at least part of one boundary of the core. Another step is positioning
7396632 Thermal mass transfer substrate films, donor elements, and methods of making and using same July 8, 2008
Substrate films, thermal mass transfer donor elements, and methods of making and using the same are provided. In some embodiments, such substrate films and donor elements include at least two dyads, wherein each dyad includes an absorbing first layer and an essentially non-absorbing
7389025 Coupling light into microresonators June 17, 2008
An optical microresonator device is described including an optical waveguide and an optical microresonator positioned so as to optically couple to the waveguide. The waveguide includes a core and a metal cladding layer on at least part of one boundary of the core.
7352213 Ac powered logic circuitry April 1, 2008
The use of an alternating current (ac) source to power logic circuitry can support satisfactory device performance for a variety of applications, while enhancing long-term stability of the circuitry. For example, when organic thin film transistor (OTFT)-based logic circuitry is powered b
7298084 Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with November 20, 2007
Methods and displays utilize row and column drivers with ZnO channels that control pixel transistors with ZnO channels, which in turn address OLEDs of an array to produce images of a display screen. A display backplane including the ZnO row and column drivers and the OLEDs may be constru
7297361 In-line deposition processes for circuit fabrication November 20, 2007
A method for circuit fabrication includes positioning first and second webs of film in proximity to each other, wherein the second web of film defines a deposition mask, and deposition material on the first web of film through the deposition mask pattern defined by the second web of the
7245151 Logic circuitry powered by partially rectified AC waveform July 17, 2007
Logic circuitry is powered by a partially rectified alternating current (ac) waveform. The waveform is partially rectified in the sense that it does not provide a clean, primarily dc power signal. Instead, it is possible to power logic circuitry with a waveform that includes a substa
7241688 Aperture masks for circuit fabrication July 10, 2007
Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for ele
7223515 Thermal mass transfer substrate films, donor elements, and methods of making and using same May 29, 2007
Substrate films, thermal mass transfer donor elements, and methods of making and using the same are provided. In some embodiments, such substrate films and donor elements include at least two dyads, wherein each dyad includes an absorbing first layer and an essentially non-absorbing
7193291 Organic Schottky diode March 20, 2007
An organic Schottky diode includes a polycrystalline organic semiconductor layer with a rectifying contact on one side of the layer. An amorphous doped semiconductor layer is placed on the other side of the polycrystalline organic semiconductor layer, and it acts as a buffer between
7167106 Methods and systems utilizing a programmable sign display located in proximity to a traffic ligh January 23, 2007
Methods and systems use a programmable sign display located in proximity to a traffic light to provide information to motorists upon the motorists directing their attention toward the traffic light. The programmable sign display may receive programming for content to be displayed in vari
7119377 II-VI/III-V layered construction on InP substrate October 10, 2006
A layered construction is provided comprising an InP substrate and alternating layers of II-VI and III-V materials. The alternating layers of II-VI and III-V materials are typically lattice-matched or pseudomorphic to the InP substrate. Typically the II-VI material is selected from t
7088145 AC powered logic circuitry August 8, 2006
The use of an alternating current (ac) source to power logic circuitry can support satisfactory device performance for a variety of applications, while enhancing long-term stability of the circuitry. For example, when organic thin film transistor (OTFT)-based logic circuitry is powered b
7078937 Logic circuitry powered by partially rectified ac waveform July 18, 2006
Logic circuitry is powered by a partially rectified alternating current (ac) waveform. The waveform is partially rectified in the sense that it does not provide a clean, primarily dc power signal. Instead, it is possible to power logic circuitry with a waveform that includes a substa
6936131 Encapsulation of organic electronic devices using adsorbent loaded adhesives August 30, 2005
Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or
6897164 Aperture masks for circuit fabrication May 24, 2005
Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for ele
6821348 In-line deposition processes for circuit fabrication November 23, 2004
In one embodiment, the invention is directed to aperture mask deposition techniques using aperture mask patterns formed in one or more elongated webs of flexible film. The techniques involve sequentially depositing material through mask patterns formed in the film to define layers, or
5879962 III-V/II-VI Semiconductor interface fabrication method March 9, 1999
A method for repeatably fabricating GaAs/ZnSe and other III-V/II-VI semiconductor interfaces with relatively low stacking fault densities in II-VI semiconductor devices such as laser diodes. The method includes providing a molecular beam epitaxy (MBE) system including at least a group










 
 
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