| Patent Number |
Title Of Patent |
Date Issued |
| 8115307 |
Embedding device in substrate cavity |
February 14, 2012 |
| An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first device having a device surface and a thickness is placed into the cavity. The thickness m |
| 7998857 |
Integrated circuit and process for fabricating thereof |
August 16, 2011 |
| A process for fabricating an Integrated Circuit (IC) and the IC formed thereby is disclosed. The process comprises providing a substrate. The process further comprises forming a plurality of longitudinal trenches in the substrate and depositing a layer of a first conductive material on a |
| 7985622 |
Method of forming collapse chip connection bumps on a semiconductor substrate |
July 26, 2011 |
| A method of forming collapse chip connection bumps on a semiconductor substrate is provided. The method includes providing a semiconductor substrate having a plurality of bump vias on a top surface of the semiconductor substrate and electroplating the plurality of bump vias to form a |
| 7956713 |
Forming a helical inductor |
June 7, 2011 |
| In one embodiment, the present invention includes an apparatus having a substrate with vias extending between first and second surfaces thereof, and at least one helical inductor adapted within a via, which may be formed of a conductive material. Other embodiments are described and c |
| 7831115 |
Optical die structures and associated package substrates |
November 9, 2010 |
| Optical die structures and associated package substrates are generally described. In one example, an electronic device includes a package substrate having a package substrate core, a dielectric layer coupled with the package substrate core, and one or more input/output (I/O) optical |
| 7790598 |
System, apparatus, and method for advanced solder bumping |
September 7, 2010 |
| According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening form |
| 7666714 |
Assembly of thin die coreless package |
February 23, 2010 |
| In one embodiment, a method comprises coupling a coreless substrate panel to a pressure cover plate of a carrier, applying flux to the coreless substrate panel, placing at least one die on the coreless substrate panel, reflowing solder onto the coreless substrate panel, defluxing the |
| 7592202 |
Embedding device in substrate cavity |
September 22, 2009 |
| An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first device having a device surface and a thickness is placed into the cavity. The thickness m |
| 7583871 |
Substrates for optical die structures |
September 1, 2009 |
| Package substrates for optical die structures are generally described. In one example, an apparatus includes a package substrate having one or more plated through hole (PTH) structures, an optical waveguide coupled with the package substrate, the optical waveguide having one or more |
| 7517788 |
System, apparatus, and method for advanced solder bumping |
April 14, 2009 |
| According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening form |
| 7013562 |
Method of using micro-contact imprinted features for formation of electrical interconnects for s |
March 21, 2006 |
| An imprinting stamp to imprint an opening in a material layer in which the imprint stamp has a coating of a seed material. The seed material is transferred onto the surface within the opening to operate as a seed for filling the opening. In one embodiment, low surface energy material is |
