| Patent Number |
Title Of Patent |
Date Issued |
| 7732393 |
Oxidation-stabilized CMP compositions and methods |
June 8, 2010 |
| The present invention provides a chemical-mechanical polishing (CMP) composition comprising an amino compound, a radical-forming oxidizing agent, a radical trapping agent capable of inhibiting radical-induced oxidation of the amino compound, and an aqueous carrier therefore. The radi |
| 7501346 |
Gallium and chromium ions for oxide rate enhancement |
March 10, 2009 |
| The invention provides a chemical-mechanical polishing composition comprising silica, a compound in an amount sufficient to provide about 0.2 mM to about 10 mM of a metal cation selected from the group consisting of gallium (III), chromium (II), and chromium (III), and water, wherein |
| 7497938 |
Tribo-chronoamperometry as a tool for CMP application |
March 3, 2009 |
| The invention provides a method of determining at least one electrochemical characteristic of a chemical-mechanical or electrochemical-mechanical polishing system comprising application of a potential between a polishing substrate and an electrode to generate a current, and determini |
| 7316603 |
Compositions and methods for tantalum CMP |
January 8, 2008 |
| A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises an abrasive, an organic oxidizer, and a liquid carrier therefor. The organic oxidizer has a standard redox potential (E.sup.0) of not more than about 0.5 V relative to a standard hydrogen electrode. The |
| 7311856 |
Polymeric inhibitors for enhanced planarization |
December 25, 2007 |
| The invention provides a chemical-mechanical polishing system comprising a polishing component, a surfactant, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the polishing system. |
| 7093722 |
Polishing composition storage container |
August 22, 2006 |
| The invention provides devices and methods for removing and trapping large and/or dense abrasive particles from a polishing slurry. The polishing slurry is introduced into a container and allowed to stagnate, thereby causing large and/or dense particles to separate from the slurry under |
| 7087187 |
Meta oxide coated carbon black for CMP |
August 8, 2006 |
| Using coated carbon black particles, coated with a selected coating material, as an abrasive in slurries or polishing pads for chemical-mechanical polishing processes. By adjusting the coating material on the carbon black particles, new abrasive particles for chemical-mechanical poli |
| 7001253 |
Boron-containing polishing system and method |
February 21, 2006 |
| The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer |
| 6867140 |
Method of polishing a multi-layer substrate |
March 15, 2005 |
| The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one |
| 6855266 |
Polishing system with stopping compound and method of its use |
February 15, 2005 |
| The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the |
| 6852632 |
Method of polishing a multi-layer substrate |
February 8, 2005 |
| The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one |
| 6830503 |
Catalyst/oxidizer-based CMP system for organic polymer films |
December 14, 2004 |
| The invention is directed to a method of polishing a substrate comprising (i) providing a substrate comprising an organic polymer film, (ii) contacting the substrate with a chemical-mechanical polishing system comprising a liquid carrier, an abrasive and/or polishing pad, a peroxy-ty |
| 6767476 |
Polishing composition for metal CMP |
July 27, 2004 |
| Chemical mechanical polishing compositions and slurries comprising a film-forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features. |
| 6705926 |
Boron-containing polishing system and method |
March 16, 2004 |
| The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or |
| 6685540 |
Polishing pad comprising particles with a solid core and polymeric shell |
February 3, 2004 |
| The invention provides a polishing pad comprising composite particles that comprise a solid core encapsulated by a polymeric shell material, wherein the solid core comprises a material that differs from the polymeric shell material, as well as a method of polishing a substrate with such |
| 6646348 |
Silane containing polishing composition for CMP |
November 11, 2003 |
| Polishing compositions comprising at least one soluble silane compound and at least one abrasive that are useful for polishing substrate surface features. |
| 6592776 |
Polishing composition for metal CMP |
July 15, 2003 |
| Chemical mechanical polishing compositions and slurries comprising a film forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features. |
| 6582623 |
CMP composition containing silane modified abrasive particles |
June 24, 2003 |
| A polishing composition comprising a dispersion of silane modified abrasive particles formed by combining at least one metal oxide abrasive having at least one surface metal hydroxide with at least one silane compound and methods for polishing substrate features such as metal features an |
| 6383065 |
Catalytic reactive pad for metal CMP |
May 7, 2002 |
| A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal features associated with integrated circuits and other |
| 6136711 |
Polishing composition including an inhibitor of tungsten etching |
October 24, 2000 |
| A chemical mechanical polishing composition comprising a composition capable of etching tungsten and at least one inhibitor of tungsten etching and methods for using the composition to polish tungsten containing substrates. |
| 6083419 |
Polishing composition including an inhibitor of tungsten etching |
July 4, 2000 |
| A chemical mechanical polishing composition comprising a composition capable of etching tungsten and one inhibitor of tungsten etching and methods for using the composition to polish tungsten containing substrates. |
| 6068787 |
Composition and slurry useful for metal CMP |
May 30, 2000 |
| A chemical mechanical polishing precursor comprising at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when admixed with an oxidizing agent prior to use to remove metal layers from a substrate. |
| 6015506 |
Composition and method for polishing rigid disks |
January 18, 2000 |
| A method for polishing computer rigid disks comprising bringing at least one surface of the rigid disk into contact with a polishing pad and applying a dispersion to the rigid disk to give a polished rigid disk having an rms roughness less than about 1.4 nm. Also disclosed is a dispe |
| 5980775 |
Composition and slurry useful for metal CMP |
November 9, 1999 |
| A chemical mechanical polishing composition comprising an oxidizing agent at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when combined with an abrasive or with an abrasive pad to remove metal layers from a substrate. |
| 5958288 |
Composition and slurry useful for metal CMP |
September 28, 1999 |
| A chemical mechanical polishing composition comprising an oxidizing agent and at least one catalyst having multiple oxidation states, the composition being useful when combined with an abrasive or with an abrasive pad to remove metal layers from a substrate. |
