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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Grumbine; Steven K.
Address:
Aurora, IL
No. of patents:
25
Patents:












Patent Number Title Of Patent Date Issued
7732393 Oxidation-stabilized CMP compositions and methods June 8, 2010
The present invention provides a chemical-mechanical polishing (CMP) composition comprising an amino compound, a radical-forming oxidizing agent, a radical trapping agent capable of inhibiting radical-induced oxidation of the amino compound, and an aqueous carrier therefore. The radi
7501346 Gallium and chromium ions for oxide rate enhancement March 10, 2009
The invention provides a chemical-mechanical polishing composition comprising silica, a compound in an amount sufficient to provide about 0.2 mM to about 10 mM of a metal cation selected from the group consisting of gallium (III), chromium (II), and chromium (III), and water, wherein
7497938 Tribo-chronoamperometry as a tool for CMP application March 3, 2009
The invention provides a method of determining at least one electrochemical characteristic of a chemical-mechanical or electrochemical-mechanical polishing system comprising application of a potential between a polishing substrate and an electrode to generate a current, and determini
7316603 Compositions and methods for tantalum CMP January 8, 2008
A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises an abrasive, an organic oxidizer, and a liquid carrier therefor. The organic oxidizer has a standard redox potential (E.sup.0) of not more than about 0.5 V relative to a standard hydrogen electrode. The
7311856 Polymeric inhibitors for enhanced planarization December 25, 2007
The invention provides a chemical-mechanical polishing system comprising a polishing component, a surfactant, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the polishing system.
7093722 Polishing composition storage container August 22, 2006
The invention provides devices and methods for removing and trapping large and/or dense abrasive particles from a polishing slurry. The polishing slurry is introduced into a container and allowed to stagnate, thereby causing large and/or dense particles to separate from the slurry under
7087187 Meta oxide coated carbon black for CMP August 8, 2006
Using coated carbon black particles, coated with a selected coating material, as an abrasive in slurries or polishing pads for chemical-mechanical polishing processes. By adjusting the coating material on the carbon black particles, new abrasive particles for chemical-mechanical poli
7001253 Boron-containing polishing system and method February 21, 2006
The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer
6867140 Method of polishing a multi-layer substrate March 15, 2005
The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one
6855266 Polishing system with stopping compound and method of its use February 15, 2005
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the
6852632 Method of polishing a multi-layer substrate February 8, 2005
The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one
6830503 Catalyst/oxidizer-based CMP system for organic polymer films December 14, 2004
The invention is directed to a method of polishing a substrate comprising (i) providing a substrate comprising an organic polymer film, (ii) contacting the substrate with a chemical-mechanical polishing system comprising a liquid carrier, an abrasive and/or polishing pad, a peroxy-ty
6767476 Polishing composition for metal CMP July 27, 2004
Chemical mechanical polishing compositions and slurries comprising a film-forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features.
6705926 Boron-containing polishing system and method March 16, 2004
The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or
6685540 Polishing pad comprising particles with a solid core and polymeric shell February 3, 2004
The invention provides a polishing pad comprising composite particles that comprise a solid core encapsulated by a polymeric shell material, wherein the solid core comprises a material that differs from the polymeric shell material, as well as a method of polishing a substrate with such
6646348 Silane containing polishing composition for CMP November 11, 2003
Polishing compositions comprising at least one soluble silane compound and at least one abrasive that are useful for polishing substrate surface features.
6592776 Polishing composition for metal CMP July 15, 2003
Chemical mechanical polishing compositions and slurries comprising a film forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features.
6582623 CMP composition containing silane modified abrasive particles June 24, 2003
A polishing composition comprising a dispersion of silane modified abrasive particles formed by combining at least one metal oxide abrasive having at least one surface metal hydroxide with at least one silane compound and methods for polishing substrate features such as metal features an
6383065 Catalytic reactive pad for metal CMP May 7, 2002
A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal features associated with integrated circuits and other
6136711 Polishing composition including an inhibitor of tungsten etching October 24, 2000
A chemical mechanical polishing composition comprising a composition capable of etching tungsten and at least one inhibitor of tungsten etching and methods for using the composition to polish tungsten containing substrates.
6083419 Polishing composition including an inhibitor of tungsten etching July 4, 2000
A chemical mechanical polishing composition comprising a composition capable of etching tungsten and one inhibitor of tungsten etching and methods for using the composition to polish tungsten containing substrates.
6068787 Composition and slurry useful for metal CMP May 30, 2000
A chemical mechanical polishing precursor comprising at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when admixed with an oxidizing agent prior to use to remove metal layers from a substrate.
6015506 Composition and method for polishing rigid disks January 18, 2000
A method for polishing computer rigid disks comprising bringing at least one surface of the rigid disk into contact with a polishing pad and applying a dispersion to the rigid disk to give a polished rigid disk having an rms roughness less than about 1.4 nm. Also disclosed is a dispe
5980775 Composition and slurry useful for metal CMP November 9, 1999
A chemical mechanical polishing composition comprising an oxidizing agent at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when combined with an abrasive or with an abrasive pad to remove metal layers from a substrate.
5958288 Composition and slurry useful for metal CMP September 28, 1999
A chemical mechanical polishing composition comprising an oxidizing agent and at least one catalyst having multiple oxidation states, the composition being useful when combined with an abrasive or with an abrasive pad to remove metal layers from a substrate.










 
 
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