| Patent Number |
Title Of Patent |
Date Issued |
| 7609461 |
Optical module having cavity substrate |
October 27, 2009 |
| A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall |
| 7560804 |
Integrated circuit package and method of making the same |
July 14, 2009 |
| Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die |
| 7425750 |
Snap lid camera module |
September 16, 2008 |
| An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is |
| 7332375 |
Method of making an integrated circuit package |
February 19, 2008 |
| A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrica |
| 7112474 |
Method of making an integrated circuit package |
September 26, 2006 |
| Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die |
| 7071541 |
Plastic integrated circuit package and method and leadframe for making the package |
July 4, 2006 |
| Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die |
| 7059040 |
Optical module with lens integral holder fabrication method |
June 13, 2006 |
| A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall |
| 7030474 |
Plastic integrated circuit package and method and leadframe for making the package |
April 18, 2006 |
| Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die |
| 7005326 |
Method of making an integrated circuit package |
February 28, 2006 |
| Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die |
| 6967395 |
Mounting for a package containing a chip |
November 22, 2005 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6962829 |
Method of making near chip size integrated circuit package |
November 8, 2005 |
| A plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections. In each section, an IC chip is attached. Bonding pads on the IC chip are electrically connected to first metallizations on a substrate first sur |
| 6946316 |
Method of fabricating and using an image sensor package |
September 20, 2005 |
| An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is |
| 6943429 |
Wafer having alignment marks extending from a first to a second surface of the wafer |
September 13, 2005 |
| A marked wafer includes a front-side surface and a back-side surface. A vertical scribe line and a horizontal scribe line are on the front-side surface of the wafer. A back-side alignment mark is located at an intersection of the vertical scribe line and the horizontal scribe line. T |
| 6893900 |
Method of making an integrated circuit package |
May 17, 2005 |
| Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad |
| 6875379 |
Tool and method for forming an integrated optical circuit |
April 5, 2005 |
| Tools and methods for making molded an optical integrated circuit including one or more waveguides are disclosed. In one embodiment, a molding die is provided that includes a substrate that has a topographically patterned first surface. A conformal protective film is provided over the fi |
| 6869861 |
Back-side wafer singulation method |
March 22, 2005 |
| A wafer includes a vertical scribe line and a horizontal scribe line on a front-side surface of the wafer. An intersection of the vertical scribe line and the horizontal scribe line is optically recognized through a wafer support attached to the front-side surface of the wafer. The wafer |
| 6849916 |
Flip chip on glass sensor package |
February 1, 2005 |
| An image sensor package includes an image sensor having an active area and bond pads on a front surface of the image sensor. A window is mounted to the image sensor by flip chip bumps formed between the bond pads of the image sensor and interior traces on an interior surface of the windo |
| 6816523 |
VCSEL package and fabrication method |
November 9, 2004 |
| A VCSEL package includes a substrate and a VCSEL device coupled to the substrate. The VCSEL device includes a first VCSEL and a calibration VCSEL. A sensor is coupled to the substrate such that a sensor area of the sensor is aligned with the calibration VCSEL. The sensor measures light |
| 6777789 |
Mounting for a package containing a chip |
August 17, 2004 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6765801 |
Optical track drain package |
July 20, 2004 |
| A package includes a substrate having a pocket, an overflow reservoir around a periphery of the pocket, and a mating surface around a periphery of the overflow reservoir. An electronic component is mounted within the pocket. The pocket is over filled with a flowable material. A window or |
| 6734419 |
Method for forming an image sensor package with vision die in lens housing |
May 11, 2004 |
| A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully supported and structurally fortified by the molded image sensor die package. An image sensor die i |
| 6730536 |
Pre-drilled image sensor package fabrication method |
May 4, 2004 |
| A central aperture is formed in a substrate. Traces are formed on a lower surface of the substrate, the traces having tabs protecting beyond a sidewall of the central aperture. An image sensor is supported in the central aperture by the tabs. By mounting the image sensor in the central |
| 6723582 |
Method of making a semiconductor package having exposed metal strap |
April 20, 2004 |
| Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power MOSFET die that is electrically connected to a portion of the substrate with a metal strap. |
| 6717126 |
Method of fabricating and using an image sensor package with reflector |
April 6, 2004 |
| A method of capturing an image at an angle to a line of sight an image sensor includes receiving radiation of the image. The received radiation is reflected towards an active area of the image sensor with a first panel of a reflector. The radiation strikes the active area and the image s |
| 6686588 |
Optical module with lens integral holder |
February 3, 2004 |
| An optical module includes a lens housing and a substrate having a base and a sidewall. An image sensor is mounted to the base. The sidewall includes a joint surface and the lens housing includes a mounting surface. The mounting surface of the lens housing is bonded to the joint surface |
| 6686580 |
Image sensor package with reflector |
February 3, 2004 |
| An image sensor package includes a substrate and an image sensor coupled to the substrate. The image sensor includes an upper surface having an active area. A reflector lid is coupled to the substrate. The reflector lid has a first panel having a planar surface. The planar surface is at |
| 6684496 |
Method of making an integrated circuit package |
February 3, 2004 |
| A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrica |
| 6672773 |
Optical fiber having tapered end and optical connector with reciprocal opening |
January 6, 2004 |
| A method and apparatus for connecting optical fibers to waveguides and other optical elements are disclosed. In one embodiment, an optical fiber is modified so as to have opposing orthogonal tapered sidewalls that taper toward a tip of the fiber. An optical connector for the fiber includ |
| 6670698 |
Integrated circuit package mounting |
December 30, 2003 |
| A packaged electronic device includes connection contacts that are formed on the contact pads on the second surface of the substrate. In contrast to the prior art, the connection contacts are not solder contacts but are formed of nickel/aluminum plated copper and are therefore harder and |
| 6667544 |
Stackable package having clips for fastening package and tool for opening clips |
December 23, 2003 |
| Embodiments of stackable packages for an electronic device, such as an integrated circuit chip or a micro-machine, are disclosed. The packages may be stacked and electrically interconnected without soldering. The package includes a molded plastic body. Stacking clips are molded into the |
| 6661080 |
Structure for backside saw cavity protection |
December 9, 2003 |
| A structure includes holes formed in a layer of tape. The holes are aligned over active areas on chips formed in a wafer. A custom vacuum chuck with a plurality of suction ports is aligned on the tape such that the suction ports contact only the tape and not the hole portions. Flats of t |
| 6657298 |
Integrated circuit chip package having an internal lead |
December 2, 2003 |
| A package for an integrated circuit chip is disclosed, along with structures and methods for making and mounting the package. An exemplary embodiment of the package includes a molded body having leads embedded therein with an aperture adjacent each of the leads. A portion of each lea |
| 6650019 |
Method of making a semiconductor package including stacked semiconductor dies |
November 18, 2003 |
| This invention provides a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process. One embodiment of the method includes the provision of a substrate and pair of semiconductor dies, each having opposite to |
| 6638789 |
Micromachine stacked wirebonded package fabrication method |
October 28, 2003 |
| To form a micromachine package, a bead is applied to the rear surface of a controller chip. The controller chip is positioned above an active area in a front surface of a micromachine chip. The bead is attached to the front surface of the micromachine chip to attach the controller chip t |
| 6630728 |
Plastic integrated circuit package and leadframe for making the package |
October 7, 2003 |
| Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad |
| 6629633 |
Chip size image sensor bumped package fabrication method |
October 7, 2003 |
| To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. The image sensor further includes a plurality of bond pads on the upper surface. Interior traces on a lower surface of a step up ring are aligned with the bond pads on the up |
| 6627987 |
Ceramic semiconductor package and method for fabricating the package |
September 30, 2003 |
| A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically |
| 6627864 |
Thin image sensor package |
September 30, 2003 |
| A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. |
| 6624921 |
Micromirror device package fabrication method |
September 23, 2003 |
| A window is mounted directly to an upper surface of a micromirror device chip. More particularly, the window is mounted above a micromirror device area on the upper surface of the micromirror device chip by a bead. The window in combination with the bead form a hermetic enclosure about t |
| 6620646 |
Chip size image sensor wirebond package fabrication method |
September 16, 2003 |
| To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active area and bond pads of the image sensor. A lower surface of a step up ring is mounted above |
| 6610167 |
Method for fabricating a special-purpose die using a polymerizable tape |
August 26, 2003 |
| A method includes adhesively mounting an adhesive lower surface of a protective layer to a top surface of a die such as an image sensor die or a micromachine die. A special-purpose area on the top surface of the die is contacted and protected by said protective layer. The protective laye |
| 6601293 |
Method of making an electromagnetic interference shield device |
August 5, 2003 |
| A method of packaging a device is disclosed. In one embodiment, a substrate including a common voltage plane and a mounting region is provided, with the device mounted to the mounting region. An electrically conductive dam structure is disposed on the surface of the substrate with the |
| 6586826 |
Integrated circuit package having posts for connection to other packages and substrates |
July 1, 2003 |
| Integrated circuit packages that may be easily stacked one on top of the other are disclosed. The package includes a molded plastic body having metal-coated interconnection posts on both its upper and lower surfaces. An integrated circuit is mounted on the upper surface. Metal traces on |
| 6586824 |
Reduced thickness packaged electronic device |
July 1, 2003 |
| An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, |
| 6586677 |
Plastic integrated circuit device package having exposed lead surface |
July 1, 2003 |
| Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, a plastic sheet having an first surface is provided. An array of package sites is formed on the first surface of the plastic sheet. The package sites each include a metal die pad and l |
| 6580167 |
Heat spreader with spring IC package |
June 17, 2003 |
| An RF shielded package includes a heat sink having a plurality of spring elements. The spring elements press the heat sink against a mold half during encapsulation to prevent encapsulant from leaking between the heat sink and the mold half. Further, the spring elements ground the heat si |
| 6580153 |
Structure for protecting a micromachine with a cavity in a UV tape |
June 17, 2003 |
| A protective layer includes a polymerized region, which forms a cavity in an interior surface of the protective layer. The protective layer is mounted to a micromachine chip such that an active area of the micromachine chip is located within the cavity of the protective layer. The pr |
| 6577013 |
Chip size semiconductor packages with stacked dies |
June 10, 2003 |
| Chip-size semiconductor packages ("CSPs") containing multiple stacked dies are disclosed. The dies are mounted on one another in a stack such that corresponding ones of the vias in the respective dies are coaxially aligned. An electrically conductive wire or pin is in each set of aligned |
| 6572944 |
Structure for fabricating a special-purpose die using a polymerizable tape |
June 3, 2003 |
| A structure for protecting a special-purpose area of an image sensor die or a micromachine die during singulation of the die from a wafer includes a protective layer that has a polymerized upper zone and an unpolymerized lower zone. At least part of the unpolymerized lower zone has an ad |
| 6571466 |
Flip chip image sensor package fabrication method |
June 3, 2003 |
| A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery o |
