| Patent Number |
Title Of Patent |
Date Issued |
| 7504718 |
Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechan |
March 17, 2009 |
| Apparatus and methods are provided for constructing balanced semiconductor chip package structures that minimize bowing, in-plane strain and/or other thermally induced mechanical strains that may arise during thermal cycling, to thus prevent structural damage to chip package structures. |
| 6974915 |
Printed wiring board interposer sub-assembly and method |
December 13, 2005 |
| The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boar |
| 6892451 |
Method of making an interposer sub-assembly in a printed wiring board |
May 17, 2005 |
| The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boar |
| 6777817 |
Reworkable and thermally conductive adhesive and use thereof |
August 17, 2004 |
| Reworkable thermally conductive adhesive composition including a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to |
| 6740959 |
EMI shielding for semiconductor chip carriers |
May 25, 2004 |
| Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic p |
| 6695623 |
Enhanced electrical/mechanical connection for electronic devices |
February 24, 2004 |
| A method and structure for electrically and mechanically interconnecting an array of printed circuit board contacts to an array of module contacts with a plurality of deformable resilient electrical conductors with two ends. Each of the conductor ends are electrically connected to one of |
| 6670223 |
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses |
December 30, 2003 |
| Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially t |
| 6617698 |
Reworkable and thermally conductive adhesive and use thereof |
September 9, 2003 |
| Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to |
| 6545226 |
Printed wiring board interposer sub-assembly |
April 8, 2003 |
| The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boar |
| 6531343 |
Method of encapsulating a circuit assembly |
March 11, 2003 |
| A method of encapsulating a circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate by applying an encapsulant adjacent the solder joint, wher |
| 6512295 |
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses |
January 28, 2003 |
| Plastic ball grid array (PBGA) packages comprised of organic carriers on which are mounted and encapsulated semiconductor chips, providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is |
| 6495771 |
Compliant multi-layered circuit board for PBGA applications |
December 17, 2002 |
| A electronic package is constituted of a compliant multi-layered circuit board or printed circuit board package, particularly for use in ball grid array (BGA) applications wherein two or possibly greater numbers of naturally spaced sub-composites are equipped with electronic circuitry |
| 6492724 |
Structure for reinforcing a semiconductor device to prevent cracking |
December 10, 2002 |
| A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a semiconductor chip is provided, an adhesion layer is applied over its top surface, followed by the |
| 6403882 |
Protective cover plate for flip chip assembly backside |
June 11, 2002 |
| A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, |
| 6326237 |
Reworkable thermoplastic hyper-branched encapsulant |
December 4, 2001 |
| The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed ad |
| 6255208 |
Selective wafer-level testing and burn-in |
July 3, 2001 |
| Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting |
| 6252779 |
Ball grid array via structure |
June 26, 2001 |
| A method for joining electronic devices such as integrated circuits to vias in a substrate. A solder ball attached to an electronic device is joined to a contact pad of a via by a low melting temperature solder. An opening of a via is plugged to prevent wicking of the low melting tempera |
| 6251707 |
Attaching heat sinks directly to flip chips and ceramic chip carriers |
June 26, 2001 |
| An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold or chromium. Such struct |
| 6236115 |
High density integrated circuit packaging with chip stacking and via interconnections |
May 22, 2001 |
| Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive pa |
| 6197619 |
Method for reinforcing a semiconductor device to prevent cracking |
March 6, 2001 |
| A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a semiconductor chip is provided, an adhesion layer is applied over its top surface, followed by the |
| 6197222 |
Lead free conductive composites for electrical interconnections |
March 6, 2001 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 6187678 |
High density integrated circuit packaging with chip stacking and via interconnections |
February 13, 2001 |
| Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive pa |
| 6165885 |
Method of making components with solder balls |
December 26, 2000 |
| An electronic component with solder ball connections is provided. A stencil is produced with holes passing through it in an arrangement corresponding to an arrangement of conductive pads on a substrate or integrated circuit. The stencil is made of a solder reflow compatible material. A l |
| 6150726 |
Component carrier with raised bonding sites |
November 21, 2000 |
| Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection |
| 6111323 |
Reworkable thermoplastic encapsulant |
August 29, 2000 |
| The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, |
| 6069023 |
Attaching heat sinks directly to flip chips and ceramic chip carriers |
May 30, 2000 |
| An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicon or flexible-epoxy adhesive. The aluminum may be coated by anodizing or Chromate conversion or the copper may be coated with nickel or gold Chromium. Such structures |
| 6002177 |
High density integrated circuit packaging with chip stacking and via interconnections |
December 14, 1999 |
| Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive pa |
| 5998876 |
Reworkable thermoplastic hyper-branched encapsulant |
December 7, 1999 |
| The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed ad |
| 5875011 |
Liquid crystal display tile interconnected to a tile carrier and method |
February 23, 1999 |
| A liquid crystal display is provided wherein a plurality of liquid crystal display tiles are arranged in a matrix and are electrically interconnected to a tile carrier by depositing an electrically conductive metal on a sidewall edge of the liquid crystal display such as by plating, |
| 5866044 |
Lead free conductive composites for electrical interconnections |
February 2, 1999 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 5847929 |
Attaching heat sinks directly to flip chips and ceramic chip carriers |
December 8, 1998 |
| An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold on chromium. Such struct |
| 5813870 |
Selectively filled adhesives for semiconductor chip interconnection and encapsulation |
September 29, 1998 |
| Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a |
| 5785799 |
Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy |
July 28, 1998 |
| An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especia |
| 5777705 |
Wire bond attachment of a liquid crystal display tile to a tile carrier |
July 7, 1998 |
| A plurality of liquid crystal display tiles arranged in a matrix are electrically interconnected to a tile carrier by wire bonds. |
| 5759737 |
Method of making a component carrier |
June 2, 1998 |
| Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection |
| 5744863 |
Chip carrier modules with heat sinks attached by flexible-epoxy |
April 28, 1998 |
| An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especil |
| 5713508 |
Stabilization of conductive adhesive by metallurgical bonding |
February 3, 1998 |
| A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for |
| 5672548 |
Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy |
September 30, 1997 |
| An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especil |
