| Patent Number |
Title Of Patent |
Date Issued |
| 7553694 |
Methods of forming a high conductivity diamond film and structures formed thereby |
June 30, 2009 |
| A method of forming a high thermal conductivity diamond film and its associated structures comprising selectively nucleating a region of a substrate, and forming a diamond film on the substrate such that the diamond film has large grains, which are at least about 20 microns in size. |
| 7501330 |
Methods of forming a high conductivity diamond film and structures formed thereby |
March 10, 2009 |
| A method of forming a high thermal conductivity diamond film and its associated structures comprising selectively nucleating a region of a substrate, and forming a diamond film on the substrate such that the diamond film has large grains, which are at least about 20 microns in size. |
| 7432532 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to trans |
October 7, 2008 |
| Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die. |
| 7417255 |
Methods of forming a high conductivity diamond film and structures formed thereby |
August 26, 2008 |
| A method of forming a high thermal conductivity diamond film and its associated structures comprising selectively nucleating a region of a substrate, and forming a diamond film on the substrate such that the diamond film has large grains, which are at least about 20 microns in size. |
| 7170098 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to trans |
January 30, 2007 |
| Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die. |
| 6921706 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to trans |
July 26, 2005 |
| Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die. |
| 6785134 |
Embedded liquid pump and microchannel cooling system |
August 31, 2004 |
| Apparatus and methods in accordance with the present invention provide self-contained, closed-loop microchannel/electrokinetic pump cooling systems that can be integrated into the microelectronic die and the integrated heat sink to provide microelectronic die cooling. Microchannel/el |
| 6770966 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to trans |
August 3, 2004 |
| Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die. |
