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Inventor: Fuse; Kenichi
Address: Tokyo, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5296649 |
Solder-coated printed circuit board and method of manufacturing the same |
March 22, 1994 |
| A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H<W, that a pad array is formed in which a width of each of the pa |
| 5268702 |
P-type antenna module and method for manufacturing the same |
December 7, 1993 |
| A ground conducting layer and an antenna element conducting layer are set at a predetermined position in a cavity of a molding die, and molten resin is injected into the cavity, thereby molding a resin-formed member in which said ground conducting layer and said antenna element conductin |
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