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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Fukushima; Yumiko
Address:
Kawasaki, JP
No. of patents:
3
Patents:












Patent Number Title Of Patent Date Issued
6984254 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using January 10, 2006
A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20 60 .mu.m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder a
6521176 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using February 18, 2003
A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
6184475 Lead-free solder composition with Bi, In and Sn February 6, 2001
A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than










 
 
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