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Inventor: Fukui; Hiroshi
Address: Chiba Prefecture, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7329706 |
Heat-conductive silicone composition |
February 12, 2008 |
| A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purp |
| 7291671 |
Thermoconductive silicone composition |
November 6, 2007 |
| A thermoconductive silicone composition comprising: (A) an organopolysiloxane (excluding component (C)), (B) a thermoconductive filler, and (C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n (I), wherein eac |
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