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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Fujii; Masayuki
Address:
Kyoto, JP
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7994616 Multilayered lead frame for a semiconductor light-emitting device August 9, 2011
A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selective
7692277 Multilayered lead frame for a semiconductor light-emitting device April 6, 2010
A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively t










 
 
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