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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Frankeny; Richard F.
Address:
Elgin, TX
No. of patents:
10
Patents:












Patent Number Title Of Patent Date Issued
5785399 Bilateral media storage unit July 28, 1998
A bilateral media storage unit for storing and carrying CD ROMs, computer diskettes, removable disk storage devices and the like. The storage unit includes a discus shaped portable housing having a generally bowl shaped lower base component and a generally bowl shaped upper cover compone
5638019 Accurately generating precisely skewed clock signals June 10, 1997
Systems and methods for accurately skewing periodic signals using a matching pair of voltage controlled delay lines, a frequency comparator, and a common control signal to the delay lines as generated by the frequency comparator. A feedback oscillation is established in a loop includ
5121299 Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavit June 9, 1992
A multi-level circuit structure is provided which includes a plurality of overlying substrates, each having at least one conductive core. A plurality of imprinted depressions are formed in each substrate, each depression having a convex surface and a concave surface. Dielectric coati
5037311 High density interconnect strip August 6, 1991
An interconnect strip is provided for effecting electrical interconnection between pluralities of conductor pads disposed on circuit boards or the like in a high density configuration. The strip is fabricated from a polymer film carrier having laminated thereon a metal foil with pres
5006924 Heat sink for utilization with high density integrated circuit substrates April 9, 1991
A heat sink for utilization in thermal management of high density integrated circuit substrates is disclosed. Each heat sink includes at least one compliant bag containing a mass of thermally conductive fluid. Within each compliant bag is an aperture which contains a thin pliable met
4975637 Method and apparatus for integrated circuit device testing December 4, 1990
A method and apparatus are disclosed for testing integrated circuit devices. A ferromagnetic test substrate is manufactured, utilizing a process substantially similar to the process utilized to create the integrated circuit devices to be tested, such that the test substrate and the i
4943242 Zero insertion force high density connector system July 24, 1990
A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulative strip carrying a plurality o
4903113 Enhanced tab package February 20, 1990
Improved tape automated bonding (TAB) packaging technology is disclosed having particular utility with semiconductor integrated circuit chips having high gate count and I/O requirements, utilizing a polymer layer of the package to support decoupling capacitor(s) mounted across power and
4453194 Integrated power circuit with current sensing means June 5, 1984
An integrated power circuit for driving an inductor load including an integrated current sensor is provided. The integrated circuit includes a power transistor in series with the inductive load for operationally conducting a load current of at least 1 amperes and circuitry for applying
4286202 Electronic damping of stepper motor August 25, 1981
A damping control system for a three phase stepper motor. A reluctance velocity transducer is used for each of the three phases. The output of each of the transducers is proportional to the rotational velocity of the motor. Each of the transducers is rotationally phase shifted 3.75 with










 
 
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