| Patent Number |
Title Of Patent |
Date Issued |
| 7553702 |
Integrating a heat spreader with an interface material having reduced void size |
June 30, 2009 |
| An integrated heat spreader and die coupled with solder are disclosed herein. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is |
| 7527090 |
Heat dissipating device with preselected designed interface for thermal interface materials |
May 5, 2009 |
| Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a |
| 7364063 |
Thermally coupling an integrated heat spreader to a heat sink base |
April 29, 2008 |
| The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched bet |
| 7362580 |
Electronic assembly having an indium wetting layer on a thermally conductive body |
April 22, 2008 |
| Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is formed on the metal bo |
| 7256058 |
Device and method for package warp compensation in an integrated heat spreader |
August 14, 2007 |
| A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and |
| 7219421 |
Method of a coating heat spreader |
May 22, 2007 |
| A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly includi |
| 7160758 |
Electronic packaging apparatus and method |
January 9, 2007 |
| An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A |
| 7102226 |
Device and method for package warp compensation in an integrated heat spreader |
September 5, 2006 |
| A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and |
| 7081669 |
Device and system for heat spreader with controlled thermal expansion |
July 25, 2006 |
| Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material w |
| 6817091 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader |
November 16, 2004 |
| An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The |
| 6751099 |
Coated heat spreaders |
June 15, 2004 |
| A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly includi |
| 6504723 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader |
January 7, 2003 |
| An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The |
| 6504242 |
Electronic assembly having a wetting layer on a thermally conductive heat spreader |
January 7, 2003 |
| An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and prov |
