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Inventor:
Enami; Hiroji
Address:
Chiba Prefecture, JP
No. of patents:
11
Patents:




Patent Number Title Of Patent Date Issued
7550548 Room-temperature-curable organopolysiloxane composition June 23, 2009
A room-temperature-curable organopolysiloxane composition comprising: (A) 100 parts by weight of an organopolysiloxane having a viscosity of from 100 to 500,000 mPas at 25.degree. C. and having in one molecule 1.5 or more end groups represented by the general formula: (X).sub.aR.sup.
7527871 Curable organopolysiloxane composition and semiconductor device May 5, 2009
A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having si
7329706 Heat-conductive silicone composition February 12, 2008
A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purp
7282270 Curable organopolysiloxane composition and a semiconductor device made with the use of this comp October 16, 2007
A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the followi
6376635 Oligosiloxane and method of preparing same April 23, 2002
An oligosiloxane having the formula (R.sup.1 O).sub.a Si(OSiR.sup.2.sub.2 R.sup.3).sub.4-a wherein R.sup.1 is alkyl; each R.sup.2 is independently selected from C.sub.1 to C.sub.10 monovalent hydrocarbyl free of aliphatic unsaturation; R.sup.3 is hydrocarbly free of aliphatic unsaturatio
6265480 Silicone gel composition July 24, 2001
A silicone gel composition comprising (A) 100 parts by weight of an organopolysiloxane comprising 80 to 98 mole % of R(CH.sub.3)SiO.sub.2/2 units, 0.1 to 10.0 mole % of RSiO.sub.3/2 units, and 0.1 to 10 mole % of R(CH.sub.3).sub.2 SiO.sub.1/2 units, wherein R is methyl, phenyl, or al
6075112 Curable silicone composition for vibration-isolating laminate June 13, 2000
A curable silicone composition for a vibration-isolating laminate comprising (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule and a viscosity of 10-100,000 mPa.s at 25.degree. C.; (B) an organopolysiloxane having at least two silicon at
6001943 Silicone gel composition and silicone gel for use in sealing and filling of electrical and elect December 14, 1999
The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperatu
6001918 Silicone gel composition for use as a sealant and a filler for electrical and electronic compone December 14, 1999
A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per
5969023 Curable silicone composition October 19, 1999
A curable silicone composition cures to form a silicone cured product with improved fire-retarding properties. The composition comprises a hydrosilylation-reaction curable silicone composition Fire-retarding properties are imparted to the composition using a silica powder with a spec
5548038 Organosiloxane compositions yielding optically clear, non-yellowing organosiloxane gels August 20, 1996
The present invention provides organosiloxane compositions that cure to optically transparent gels by a hydrosilation reaction and contain a) two types of alkenyl-substituted organopolysiloxanes, and b) a diorganopolysiloxane containing an average of at least two silicon-bonded hydro


 
 
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