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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Egawa; Yoshinori
Address:
Tokyo, JP
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
5100332 IC socket March 31, 1992
An IC socket including a socket board having a plurality of contacts on which an IC is to be placed, an IC pressing cover open- and closeably pivotally connected to the socket board, and an IC loading table with the IC loaded thereon, the table being disposed on the socket board and
4750891 Lattice shaped arrangement type socket for IC package June 14, 1988
There is disclosed a socket for an IC package in which many IC lead wires project from the IC package and are arranged in vertical rows Y and lateral rows X, and the respective IC lead wires are arranged at equal pitches on the vertical rows Y and the lateral rows X. The socket, has a
4560216 Connector with component removal means December 24, 1985
An IC socket with a mechanism for removing an IC package mounted therein and which has terminals to be brought into contact with terminals of the IC socket, the IC socket has a socket body with terminals around a package receiving recess to receive terminals of the IC package, a cover pi
4535887 IC Package carrier August 20, 1985
An IC package carrier comprises a carrier body having a receiving section defined therein for accommodating an IC package therein, a pair of latch levers disposed on the opposite sides of the receiving section and supported by the walls of the carrier body defining the receiving section










 
 
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