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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Echigo; Noriyasu
Address:
Kobe, JP
No. of patents:
16
Patents:












Patent Number Title Of Patent Date Issued
7118984 Method for fabricating semiconductor component October 10, 2006
Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An
6942903 Thin film, method and apparatus for forming the same, and electronic component incorporating the September 13, 2005
A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition
6879481 Layered product and capacitor April 12, 2005
A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 .mu.m or below, a protrusion forming component is not added to the thin resin layer or the surface roug
6838153 Layered product, capacitor and a method for producing the layered product January 4, 2005
A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating a thin metal layer,
6829135 Layered product, capacitor, electronic component and method and apparatus manufacturing the same December 7, 2004
Resin thin films (12) and metal thin films (11a, 11b) are layered in alternation. The metal thin films are set back from the peripheral edges of the resin thin films (12). Via holes (13a, 13b) penetrating the layered product in the layering direction are formed and filled with conductive
6714401 Thin film, method and apparatus for forming the same, and electronic component incorporating the March 30, 2004
A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition
6710997 Layered product and capacitor March 23, 2004
A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 .mu.m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of
6704190 Layered product and capacitor March 9, 2004
A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 .mu.m or below, a protrusion forming component is not added to the thin resin layer or the surface roug
6602559 Thin film, method and apparatus for forming the same, and electronic component incorporating the August 5, 2003
A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition
6577493 Layered product and capacitor June 10, 2003
A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 .mu.m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of
6488985 Thin film, method and apparatus for forming the same, and electronic component incorporating the December 3, 2002
A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition
6413456 Method for manufacturing electronic parts July 2, 2002
In a method for manufacturing electronic parts by laminating metal thin films and insulating thin films on a support, a mold releasing agent is applied to the support before the start of lamination. Alternatively, the mold releasing agent is applied to the surface of the laminate during
6270832 Method for manufacturing a layered product August 7, 2001
Before forming resin layers and metal thin film layers on a rotating supporting base, a belt-shaped object is run over the supporting base to remove foreign particles adhering to the supporting base. After a resin layer and a metal thin film layer are formed on the belt-shaped object and
6195249 Electronic component having gaps between conductive thin films February 27, 2001
An electronic component provided with a dielectric thin film (4), normal electrodes (1a, 1b) formed on the thin film (4), dummy electrodes (2a,2b) formed on the dielectric thin film (4) with an insulating region (20) therebetween, and auxiliary electrodes (3) provided on both side faces
6165832 Method for manufacturing a capacitor December 26, 2000
A method for manufacturing a capacitor includes the step of depositing metal thin film layers and resin layers alternating with each other, thereby forming a layered product. The thickness of the resin layer and the metal thin film or the width of margins are measured during the depo
6153259 Thin film, method and apparatus for forming the same, and electronic component incorporating the November 28, 2000
A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition










 
 
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