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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Ead; George J.
Address:
Methuen, MA
No. of patents:
6
Patents:




Patent Number Title Of Patent Date Issued
6159772 Packaging electrical circuits December 12, 2000
A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces
6119923 Packaging electrical circuits September 19, 2000
A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces
6096981 Packaging electrical circuits August 1, 2000
A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator is set forth. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal
5906310 Packaging electrical circuits May 25, 1999
A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces
5808358 Packaging electrical circuits September 15, 1998
A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces
5727727 Flowing solder in a gap March 17, 1998
The invention features a method for flowing solder in a gap between two surfaces. A supply of solder is heated to cause it to reflow and flow in the gap. The solder is directed to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the


 
 
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