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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Dunn; Gregory J.
Address:
Arlington Heights, IL
No. of patents:
41
Patents:












Patent Number Title Of Patent Date Issued
8111913 Countermeasures against original background retrieval February 7, 2012
A device and method of modifying an image containing a foreground and an original or substitute background are disclosed. Boundary pixels contain only the original background or the original background and the foreground. The original background is replaced by a predetermined or rand
8036716 Temporary storage or specialized transmission of multi-microphone signals October 11, 2011
A communication device contains multiple microphones that receive acoustic signals from a user and from the background. The acoustic signals from the user are enhanced using the background acoustic signals to reduce background noise. The enhanced signal are transmitted to an emergenc
7833292 Channel method for forming a capacitor November 16, 2010
An improved method for forming a capacitor. The method includes providing a carrier with a channel therein, providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil, securing the metal foil into the channel with the first dielectric away from a
7605048 Method for forming a capacitor having a copper electrode and a high surface area aluminum inner October 20, 2009
High capacitance value capacitors are formed using bimetal foils of an aluminum layer attached to a copper layer. The copper side of a bimetallic copper/aluminum foil or a monometallic aluminum foil is temporarily protected using aluminum or other materials, to form a sandwich. The e
7557304 Printed circuit board having closed vias July 7, 2009
Closed vias are formed in a multilayer printed circuit board by laminating a dielectric layer to one side of a central core having a metal layer on each side. A second dielectric layer is laminated to the other side of the central core. Closed vias in the central core have been formed by
7528788 High impedance electromagnetic surface and method May 5, 2009
A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive
7518465 Tunable high impedance surface device April 14, 2009
A tunable high impedance surface device (100) includes a conductive ground plane (105) and a plurality of conductive elements (110-114) electrically connected to the conductive ground plane (105). The device (100) also includes a plurality of capacitive elements (120-124) operable to var
7459202 Printed circuit board December 2, 2008
A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the flanges are embedded into the surface of the prepreg, creating via holes in the laminate tha
7451540 Method for fabricating a printed circuit board November 18, 2008
Fabricating (100, 1300) a printed circuit board includes fabricating patterned conductive traces (305, 310, 1410, 1415) onto a foil, laminating the patterned conductive traces to a printed circuit board substrate (405, 1505) by pressing on the foil, such that the conductive traces ar
7444727 Method for forming multi-layer embedded capacitors on a printed circuit board November 4, 2008
A method for forming embedded capacitors on a printed circuit board is disclosed. The capacitor is formed on the printed circuit board by a depositing a first dielectric layer over one or more electrodes situated on the PCB. Another electrode is formed on top of the first dielectric
7427562 Method for fabricating closed vias in a printed circuit board September 23, 2008
A method for forming closed vias in a multilayer printed circuit board. A dielectric layer is laminated to one side of a central core having a metal layer on each side. A second dielectric layer is laminated to the other side of the central core. Closed vias in the central core have been
7423608 High impedance electromagnetic surface and method September 9, 2008
A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive
7361847 Capacitance laminate and printed circuit board apparatus and method April 22, 2008
A method is for fabricating an embedded capacitance printed circuit board assembly (400, 1100). The embedded capacitance printed circuit board assembly includes two embedded capacitance structures (110). Each capacitance structure (110) includes a crystallized dielectric oxide layer
7361568 Embedded capacitors and methods for their fabrication and connection April 22, 2008
Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper lay
7337528 Textured dielectric patch antenna fabrication method March 4, 2008
A textured dielectric patch antenna is fabricated by applying a first mask pattern (310, 510, 610, 710, 915, 1015, 1210) to a first side of a solid panel made of a first material that is a ceramic dielectric and then sandblasting the solid panel through the first mask pattern from the
7241510 Peelable circuit board foil July 10, 2007
In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited lay
7193838 Printed circuit dielectric foil and embedded capacitors March 20, 2007
A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized die
7138068 Printed circuit patterned embedded capacitance layer November 21, 2006
A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer with
7105913 Two-layer patterned resistor September 12, 2006
A technique for fabricating a patterned resistor on a substrate produces a patterned resistor (101, 801, 1001, 1324, 1374) including two conductive end terminations (110, 810, 1010) on the substrate, a pattern of first resistive material (120, 815, 1015) having a first width (125) and a
7079373 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna July 18, 2006
A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 665, 1605, 1610), and a dielectric layer (405,
7078796 Corrosion-resistant copper bond pad and integrated device July 18, 2006
The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion rut
7056800 Printed circuit embedded capacitors June 6, 2006
One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first electrode, a second electrode (615) overlyi
7038571 Polymer thick film resistor, layout cell, and method May 2, 2006
A printed circuit polymer thick film (PTF) resistor includes tolerance control material that substantially surrounds the resistor body and significantly improves the linearity of resistance vs. resistor length, and significantly reduces resistor-to-resistor and board-to-board fabrica
7030815 Integrated patch antenna and electronics assembly and method for fabricating April 18, 2006
An integrated patch antenna and electronics assembly (300) comprises an antenna dielectric layer (305), a ground plane layer (310) disposed on a first side of the antenna dielectric layer, a printed circuit dielectric layer (315) disposed on the ground plane layer opposite the antenna
6872468 Peelable circuit board foil March 29, 2005
In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has a an exposed surface (212) that is coated with a high temperature anti-oxidant
6841080 Multi-layer conductor-dielectric oxide structure January 11, 2005
A dielectric film is formed on a free-standing conductive metal layer to form a multi-layer foil comprising a conductive metal layer, a barrier layer and a dielectric oxide layer. Such multi-layer foils are mechanically flexible, and useful for the manufacture of capacitors. Examples
6777727 Flexural plate wave systems August 17, 2004
An exemplary system and method for providing an acoustic plate wave apparatus is disclosed as comprising inter alia: a monocrystalline silicon substrate (200); an amorphous oxide material (220); a monocrystalline perovskite oxide material (230); a monocrystalline piezoelectric material
6606793 Printed circuit board comprising embedded capacitor and method of same August 19, 2003
A method for forming an embedded low profile capacitor in a multilayer printed circuit board. The method entails providing a first metal plate on a dielectric substrate. A dielectric layer of a photopolymeric material is applied onto a first region of the first metal plate, surrounded by
6541137 Multi-layer conductor-dielectric oxide structure April 1, 2003
A dielectric film is formed on a free-standing conductive metal layer to form a multi-layer foil comprising a conductive metal layer, a barrier layer and a dielectric oxide layer. Such multi-layer foils are mechanically flexible, and useful for the manufacture of capacitors. Examples
6440318 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor August 27, 2002
A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negativ
6349456 Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electro February 26, 2002
A method for manufacturing a microelectronic assembly to have aligned conductive regions and dielectric regions with desirable processing and dimensional characteristics. The invention is particularly useful for producing integral capacitors, with the desired processing and dimensional
6342164 Pinhole-free dielectric films January 29, 2002
A method for producing a pinhole-free dielectric film comprising applying a photopolymer to a first dielectric surface of a dielectric film having pinholes, exposing a second and opposing surface to an amount of radiation effective to polymerize the photopolymer exposed by the pinholes,
6232042 Method for manufacturing an integral thin-film metal resistor May 15, 2001
A method for manufacturing a microelectronic assembly to have a resistor, and particularly a metal resistive film, with desirable processing and dimensional characteristics. The method generally entails applying a photosensitive dielectric to a substrate to form a dielectric layer. The
6229098 Method for forming a thick-film resistor and thick-film resistor formed thereby May 8, 2001
A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An o
6194990 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor February 27, 2001
A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negativ
6171921 Method for forming a thick-film resistor and thick-film resistor formed thereby January 9, 2001
A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An o
6130601 Thick-film resistor having concentric terminals and method therefor October 10, 2000
A thick-film resistor and a process for forming the resistor to have accurate dimensions, thereby yielding a precise resistance value. The resistor generally includes an electrically resistive layer and a pair of terminals, a first of which is surrounded by the second terminal, so as to
6108212 Surface-mount device package having an integral passive component August 22, 2000
The surface-mount device package comprises a pad located on a face of the surface-mount device, a solder bump bonded to the pad, and a terminal spaced radially apart from the pad. A terminal surrounds the pad in at least one common plane that bisects the pad and the terminal. An elec
6103134 Circuit board features with reduced parasitic capacitance and method therefor August 15, 2000
A method for fabricating circuit board conductors with desirable processing and reduced self and mutual capacitance. The method generally entails forming a metal layer on a positive-acting photodielectric layer formed on a substrate, and then etching the metal layer to form at least two
5994997 Thick-film resistor having concentric terminals and method therefor November 30, 1999
A thick-film resistor and a process for forming the resistor to have accurate dimensions, thereby yielding a precise resistance value. The resistor generally includes an electrically resistive layer and a pair of terminals, a first of which is surrounded by the second terminal, so as to
5912507 Solderable pad with integral series termination resistor June 15, 1999
A microelectronic assembly, such as a surface-mount device or a ball-grid array (BGA) package, has one or more integral resistors. The integral resistors are incorporated into one or more of the microelectronic assembly's electrical leads or connections. The integral resistors prefer










 
 
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