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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Domon; Takaaki
Address:
Tokyo, JP
No. of patents:
6
Patents:












Patent Number Title Of Patent Date Issued
8064211 Passive component and electronic component module November 22, 2011
An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed
7974043 Thermally assisted magnetic head July 5, 2011
A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate; the slider has a slider substrate and a magnetic head portion disposed on a
7957085 Thermally assisted magnetic head, head gimbal assembly, and hard disk drive June 7, 2011
A thermally assisted magnetic head has a slider substrate having a first surface located on the opposite side to a medium-facing surface, and side surfaces located between the medium-facing surface and the first surface; a magnetic head portion having a waveguide having a light exit face
7940486 Thermally assisted magnetic head, head gimbal assembly, and hard disk drive May 10, 2011
A laser diode is fixed to a light source support substrate and a first surface of a slider substrate is fixed to a second surface of the light source support substrate; therefore, the slider substrate and the laser diode are kept in a fixed positional relation. Since the laser diode
7804655 Thermally assisted magnetic head September 28, 2010
A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate. The slider has a slider substrate and a magnetic head portion disposed on a
7125788 Circuit device and method of manufacturing the circuit device October 24, 2006
A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the su










 
 
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