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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Deppisch; Carl L.
Address:
Chandler, AZ
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
7704798 Electronic assemblies with hot spot cooling and methods relating thereto April 27, 2010
A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an em
7672132 Electronic packaging apparatus and method March 2, 2010
An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A
7489033 Electronic assembly with hot spot cooling February 10, 2009
A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an em
7362580 Electronic assembly having an indium wetting layer on a thermally conductive body April 22, 2008
Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is formed on the metal bo
7160758 Electronic packaging apparatus and method January 9, 2007
An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A










 
 
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