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Inventor:
Dalmia; Sidharth
Address:
Norcross, GA
No. of patents:
6
Patents:












Patent Number Title Of Patent Date Issued
8013688 Liquid crystalline polymer and multilayer polymer-based passive signal processing components for September 6, 2011
The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufact
7989895 Integration using package stacking with multi-layer organic substrates August 2, 2011
Example embodiments of the invention may provide for a multi-package system. The multi-package system may include a first package having a plurality of first organic dielectric layers, where the first package includes at least one first conductive layer positioned between two of the
7808434 Systems and methods for integrated antennae structures in multilayer organic-based printed circu October 5, 2010
Embodiments of the invention may provide for a variety of antennae structures, including the following: a) antennae structures printed directly on the sides of the radio frequency (RF) module or integrated passive device (IPD), b) printed antennae structures fabricated on preformed d
7795995 Liquid crystalline polymer and multilayer polymer-based passive signal processing components for September 14, 2010
The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufact
7489914 Multi-band RF transceiver with passive reuse in organic substrates February 10, 2009
The present invention allows for the use of chip-package co-design of RF transceivers and their components by using discrete active devices in conjunction with passive components. Two particular components are described, including voltage controlled oscillators (VCOs) and low noise a
7439840 Methods and apparatuses for high-performing multi-layer inductors October 21, 2008
Embodiments of the present invention may provide for high-performing inductor structures utilizing multi-layer organic stackups. In particular, these high-performing inductor structures may be formed of one or more stitched metal layer building blocks, which are each formed of at lea










 
 
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