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Csillag; Frank L.
Hopkinton, MA
No. of patents:

Patent Number Title Of Patent Date Issued
7919815 Spinel wafers and methods of preparation April 5, 2011
Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching

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