Inventor:Csillag; Frank L.
No. of patents:1
||Title Of Patent
||Spinel wafers and methods of preparation
||April 5, 2011|
|Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching |